EP0113820A2
Expired / Lapsed
EP
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Method and apparatus for embedding wire in a photocurable adhesive
Assignee: International Business Machines Corp
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Filing: 1983-11-03
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Granted: —
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Expires: 2003-11-03
Abstract
Abstract The method and apparatus for embedding wire (14) in a photocurable adhesive is particularly useful in the fabrication of an encapsulated wire circuit board. Wire is laid in a softened layer (12) of photocurable adhesive and simultaneously the photocurable adhesive is cured. The curing process may be carried out in either one or two steps. The apparatus used in the one step process and in the first step of the two step process includes an adhesive heating means (16) as well as an adhesive optical curing means (17). The second step of the two step process uses an optical curing oven (35). By simultaneously curing the adhesive as the wire (14) is laid, the position integrity of the wire pattern is maintained.
Inventors
- 👤 Philip Gordan Jones
- 👤 Eugene Roman Skarvinko
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 03:34
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/103; H05K7/00; H05K7/02; H05K7/06; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K2203/00; H05K2203/11; H05K2203/1105; H05K3/38; H05K3/386
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
79 words
An apparatus for embedding wire (14) in a layer (12) of photocurable adhesive on a laminate sheet (11), comprising: wiring means (15) for laying a length of wire (14) in a softened layer (12) of said photocurable adhesive, and illuminating means (17) for directing a beam of radiation to said softened layer (12) of photocurable adhesive as said length of wire is being laid, whereby said softened layer (12) of photocurable adhesive containing said length of wire is cured.
Claim 2
Independent Claim
79 words
An apparatus for embedding wire (14) in a layer (12) of photocurable adhesive on a laminate sheet (11), comprising: wiring means (15) for laying a length of wire (14) in a softened layer (12) of said photocurable adhesive, and illuminating means (17) for directing a beam of radiation to said softened layer (12) of photocurable adhesive as said length of wire is being laid, whereby said softened layer (12) of photocurable adhesive containing said length of wire is cured.
Claim 3
Dependent Claim
20 words
The embedding apparatus according to claim 1, further comprising: heating means (16) for softening said layer (12) of photocurable adhesive.
Claim 4
Dependent Claim
59 words
The embedding apparatus according to claim 2, wherein said heating means (16) selectively softens one or more areas in said layer (12) of photocurable adhesive on said laminate sheet (11), and said beam directing means (17) selectively directs a beam of radiation to each softened area as a wire (14) is being laid, whereby each softened area is cured.
Claim 5
Independent Claim
92 words
An apparatus for embedding wire in a layer (12) of photocurable adhesive on a laminate sheet (11), comprising: wiring means (15) for laying a length of wire (14) in a softened layer (12) of said photocurable adhesive, illuminating means (17) for partially curing said softened layer (12) around said wire (14) as it is being laid, and curing means (35) for scanning a beam of radiation (34) across at least said partially cured areas of said photocurable adhesive containing said wire (14), whereby said wire is permanently fixed in said photocurable adhesive.
Claim 6
Independent Claim
92 words
An apparatus for embedding wire in a layer (12) of photocurable adhesive on a laminate sheet (11), comprising: wiring means (15) for laying a length of wire (14) in a softened layer (12) of said photocurable adhesive, illuminating means (17) for partially curing said softened layer (12) around said wire (14) as it is being laid, and curing means (35) for scanning a beam of radiation (34) across at least said partially cured areas of said photocurable adhesive containing said wire (14), whereby said wire is permanently fixed in said photocurable adhesive.
Claim 7
Dependent Claim
20 words
The embedding apparatus according to claim 4, further comprising: heating means (16) for softening said layer (12) of photocurable adhesive.
Claim 8
Dependent Claim
25 words
The embedding apparatus according to claim 5, wherein said heating means comprises a source of optical energy or a source of ultrasonic energy, or both.
Claim 9
Dependent Claim
127 words
The embedding apparatus according to one or more of claims 4, 5, and 6, said curing means (35) comprising: clamping means for securing thereto said laminate sheet (11) containing said wires (14) in said partially cured layer (14) of photocurable adhesive, a source (29) of optical energy for producing said beam of radiation (34), optical means (22-25, 32) for directing said beam of radiation (34) from said source (29) onto said partially cured laminate sheet (11), motor means (26, 31) for scanning said beam of radiation (34) across said laminate sheet (11), and control means (28) connected to said optical means for controlling the scanning of said beam of radiation (34) across the entire laminate sheet (11) to permanently fix said wires (14) in said photocurable adhesive.
Claim 10
Independent Claim
53 words
A method for embedding wire (14) in a layer (12) of photocurable adhesive, comprising the steps of: laying said wire in a softened layer (12) of said photocurable adhesive, and illuminating said softened layer (12) of photocurable adhesive around said wire (14) as said wire is being laid to cure said photocurable adhesive.
Claim 11
Independent Claim
53 words
A method for embedding wire (14) in a layer (12) of photocurable adhesive, comprising the steps of: laying said wire in a softened layer (12) of said photocurable adhesive, and illuminating said softened layer (12) of photocurable adhesive around said wire (14) as said wire is being laid to cure said photocurable adhesive.
Claim 12
Dependent Claim
27 words
The embedding method according to claim 8, additionally comprising the step of heating said layer (12) of photocurable adhesive prior to the step of laying said wire.
Claim 13
Independent Claim
70 words
A method for embedding wire (14) in a layer (12) of photocurable adhesive, comprising the steps of: laying said wire (14) in a softened layer (12) of said photocurable adhesive, partially curing said softened layer (12) of photocurable adhesive around said wire (14) as said wire is being laid, and permanently fixing said wire (14) in said photocurable adhesive by scanning a beam of radiation (34) across said photocurable adhesive.
Claim 14
Independent Claim
70 words
A method for embedding wire (14) in a layer (12) of photocurable adhesive, comprising the steps of: laying said wire (14) in a softened layer (12) of said photocurable adhesive, partially curing said softened layer (12) of photocurable adhesive around said wire (14) as said wire is being laid, and permanently fixing said wire (14) in said photocurable adhesive by scanning a beam of radiation (34) across said photocurable adhesive.
Claim 15
Dependent Claim
25 words
The embedding method according to claim 10, additionally comprising the step of heating said photocurable adhesive prior to the step of laying said wire (14).
Claim 16
Independent Claim
86 words
A method for embedding a plurality of wires (14) in a photocurable adhesive on a laminate sheet (11) used in an encapsulated wire circuit board, said method comprising the steps of: selectively heating a plurality of areas in a layer (12) of said photocurable adhesive on said laminate sheet (11) to soften said areas, selectively laying one of said wires (14) in each of said softened areas, and selectively illuminating each of said softened areas around each of said wires (14) to cure said photocurable adhesive.
Claim 17
Independent Claim
86 words
A method for embedding a plurality of wires (14) in a photocurable adhesive on a laminate sheet (11) used in an encapsulated wire circuit board, said method comprising the steps of: selectively heating a plurality of areas in a layer (12) of said photocurable adhesive on said laminate sheet (11) to soften said areas, selectively laying one of said wires (14) in each of said softened areas, and selectively illuminating each of said softened areas around each of said wires (14) to cure said photocurable adhesive.
Claim 18
Independent Claim
111 words
A method for embedding a plurality of wires (14) in a photocurable adhesive on a laminate sheet (11) used in an encapsulated wire circuit board, said method comprising the steps of: selectively heating a plurality of areas in a layer (12) of said photocurable adhesive on said laminate sheet to soften said areas, selectively laying one of said wires (14) in each of said softened areas, partially curing each of said softened areas around each of said wires (14) as each of said wires is being laid, and permanently fixing said wires (14) in said softened areas by scanning a beam of radiation (34) across said layer (12) of photocurable adhesive.
Claim 19
Independent Claim
111 words
A method for embedding a plurality of wires (14) in a photocurable adhesive on a laminate sheet (11) used in an encapsulated wire circuit board, said method comprising the steps of: selectively heating a plurality of areas in a layer (12) of said photocurable adhesive on said laminate sheet to soften said areas, selectively laying one of said wires (14) in each of said softened areas, partially curing each of said softened areas around each of said wires (14) as each of said wires is being laid, and permanently fixing said wires (14) in said softened areas by scanning a beam of radiation (34) across said layer (12) of photocurable adhesive.
References Cited (Backward Citations)
No citation records indexed.
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