EP0111709A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Telescoping thermal conduction element for cooling semiconductor devices
Assignee: International Business Machines Corp
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Filing: 1983-11-03
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Granted: —
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Expires: 2003-11-03
Abstract
Abstract A thermal bridge element (20) conducts heat from a semiconductor (14) to a cold plate or cap (22) located in close proximity to the semiconductor. It has a first plate (40) in contact with the semiconductor surface, a first spiral strip (44) of thin, heat conductive material joined to the first plate, a second plate (42) to be placed in contact with the cold plate or cap with a second spiral strip (46) of thin, heat conductive material interleaved with the first spiral strip and in partially overlapping telescoping relation, the second spiral strip joined to the second plate. A means (48) biases the first and second plates (40, 42) outwardly relative to each other.
Inventors
- 👤 Andre Sharon
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 21:39
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
127 words
A thermal bridge element (20) for use in a semiconductor package (10) to conduct heat from a semiconductor device (14) to a cold plate (22) located in close proximity to the device, comprising a first plate (40) to be placed in contact with said semiconductor device (14), a second plate to be placed in contact with said cold plate (22) spaced from said device, characterized by a first spiral strip (44) of thin, heat conductive material joined to said first plate, a second spiral strip (46) of thin, heat conductive material interleaved with said first spiral strip in partially overlapping telescoping relation, said second spiral strip joined to said second plate, and means (48) to bias said first and said second plates outwardly relative to each other.
Claim 2
Dependent Claim
127 words
A thermal bridge element (20) for use in a semiconductor package (10) to conduct heat from a semiconductor device (14) to a cold plate (22) located in close proximity to the device, comprising a first plate (40) to be placed in contact with said semiconductor device (14), a second plate to be placed in contact with said cold plate (22) spaced from said device, characterized by a first spiral strip (44) of thin, heat conductive material joined to said first plate, a second spiral strip (46) of thin, heat conductive material interleaved with said first spiral strip in partially overlapping telescoping relation, said second spiral strip joined to said second plate, and means (48) to bias said first and said second plates outwardly relative to each other.
Claim 3
Dependent Claim
30 words
The thermal bridge element of claim 1, wherein said plates (40, 42) and spiral strips (44, 46) are formed of copper or alloys that include a major portion of copper.
Claim 4
Dependent Claim
29 words
The thermal bridge element of claim 2, wherein said plates (40, 42) and spiral strips (44, 46) are formed of an alloy consisting of 99,8% Cu and 0,2% Zr.
Claim 5
Dependent Claim
28 words
The thermal bridge element of claim 1, wherein said first and second plates (40, 42) are joined to said first and second thin strips (44, 46) by soldering.
Claim 6
Dependent Claim
32 words
The thermal bridge element of claim 1, wherein the thickness of said first and second thin strips (44, 46) is in the range of 2,5 to 254 µm (0.1 to 10 mils).
Claim 7
Dependent Claim
27 words
The thermal bridge element of claim 1, wherein said means to bias said first and second plates (40, 42) outwardly is a centrally located coil spring (48).
Claim 8
Dependent Claim
27 words
The thermal bridge element of claim 6, which further includes a restraining means to prevent separation of said first and said second overlying thin strips (44, 46).
Claim 9
Independent Claim
83 words
A method of fabricating a telescoping thermal bridge element (20) comprising forming a pair of thin elongated strips of a heat conductive material; placing said strips in overlying position in partially overlapping relation in the transverse direction; rolling said overlying strips into a single strip coil (44, 46); affixing a first metal plate (40) to the protruding transverse edge of a first one of said strips (44); affixing a second metal plate (42) to the protruding transverse edge of the second strip (46).
Claim 10
Independent Claim
83 words
A method of fabricating a telescoping thermal bridge element (20) comprising forming a pair of thin elongated strips of a heat conductive material; placing said strips in overlying position in partially overlapping relation in the transverse direction; rolling said overlying strips into a single strip coil (44, 46); affixing a first metal plate (40) to the protruding transverse edge of a first one of said strips (44); affixing a second metal plate (42) to the protruding transverse edge of the second strip (46).
Claim 11
Dependent Claim
29 words
The method of claim 8, wherein a coil spring (48) is inserted in the center of said strip coil (44, 46) prior to affixing said second metal plate (46).
Claim 12
Dependent Claim
24 words
The method of claim 9, wherein said first and said second plates (40, 42) are affixed to the strip coil (44, 46) by soldering.
References Cited (Backward Citations)
No citation records indexed.
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