EP0111327B1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A composition useful for making circuit board substrates
Assignee: BP Corp North America Inc
•
Filing: 1983-12-08
•
Granted: 1988-06-29
•
Expires: 2003-12-08
Abstract
Abstract Described herein is a composition useful for making circuit board substrates and/or electrical connectors comprising a blend of a poly(aryl ether), a poly(etherimide) polymer, a fiber and a filler. Also described herein is a circuit board substrate and/or electrical connector made from a blend of poly(aryl ether) and a poly(etherimide) polymer, and/or fiber, and/or filler.
Inventors
- 👤 James Elmer Harris
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 04:16
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; C; C08; C08L; C08L71/00; C08L79/00; C08L79/04; C08L79/08; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/303; H01B3/306; H01B3/42; H01B3/427
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
26 words
A circuit board substrate comprising a blend of 10 to 60 weight percent of a poly(aryl ether) and 40 to 90 weight percent of poly(etherimide) polymer.
Claim 2
Dependent Claim
26 words
A circuit board substrate comprising a blend of 10 to 60 weight percent of a poly(aryl ether) and 40 to 90 weight percent of poly(etherimide) polymer.
Claim 3
Dependent Claim
28 words
A circuit board substrate as defined in claim 1 which contains 5 to 40 weight percent of a fiber and/or 15 to 40 weight percent of a filler.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.