EP0110285A2
Expired / Lapsed
EP
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Interconnection of integrated circuits
Assignee: Prutec Ltd
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Filing: 1983-11-21
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Granted: —
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Expires: 2003-11-21
Abstract
Abstract The invention describes a method of producing an electrical circuit incorporating integrated circuits on semiconductor chips, which comprises mounting the electrical components (10) which are to constitute the circuit including the unpackaged semiconductor chips on an insulating substrate (12) in such a manner that the contact areas of the components lie in a substantially flat plane, and depositing a conductive pattern over the substrate to establish electrical connection between the components of the circuit.
Inventors
- 👤 Francis Emile Jasper
- 👤 Josephus Bonifacius Peeters
- 👤 Edward Keith Browne
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-26 09:29
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; H10W70/00; H10W70/099; H10W70/60; H10W70/611; H10W70/614; H10W72/00; H10W72/01; H10W72/0198; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/351; H10W72/353; H10W72/354; H10W90/00; H10W90/10; H10W99/00
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
72 words
A method of producing an electrical cir.cuit incorporating integrated circuits on semiconductor chips, characterised by the steps of mounting the electrical components which are to constitute the circuit, including the unpackaged semiconductor chips, on an insulating substrate in such a manner that the contact areas of the components lie in a substantially flat plane, and depositing a conductive pattern over the substrate to establish electrical connection between the components of the circuit.
Claim 2
Independent Claim
72 words
A method of producing an electrical cir.cuit incorporating integrated circuits on semiconductor chips, characterised by the steps of mounting the electrical components which are to constitute the circuit, including the unpackaged semiconductor chips, on an insulating substrate in such a manner that the contact areas of the components lie in a substantially flat plane, and depositing a conductive pattern over the substrate to establish electrical connection between the components of the circuit.
Claim 3
Dependent Claim
48 words
A method as claimed in claim 1, wherein the components to constitute the circuit are mounted on the insulating substrate by a process of encapsulation in which the components are placed face down in predetermined positions on a flat surface and a resin is cast around the components.
Claim 4
Dependent Claim
46 words
A method as claimed in claim 2, wherein the casting of the resin is performed in two stages, resin being cast in the region immediately surrounding the components and cured under vacuum before the remainder of the resin, constituting the bulk of the substrate, is cast.
Claim 5
Dependent Claim
30 words
A method as claimed in claim 2 or 3, wherein the components are mounted in holes in a metal matrix the resin being cast within the holes of the matrix.
Claim 6
Independent Claim
24 words
A method as claimed in any preceding claim, wherein the electrically conductive pattern is formed of a cured photo-polymer loaded with a conductive powder.
Claim 7
Dependent Claim
50 words
A method as claimed in claim 5, wherein the electrical conductors interconnecting the components mounted in the circuit board are formed of a multi-layer structure containing cured polymer layers loaded with conductive powder and acting as conductors alternating with polymer layers not loaded with conductive powder and acting as insulators.
Claim 8
Dependent Claim
43 words
A method as claimed in claim 5 or 6, wherein the photo-polymerisable material to form electrical conductors is loaded with silver powder in which the particles are in the form of flakes, the mean particle size is in the region of 0.3 microns.
Claim 9
Dependent Claim
58 words
A method as claimed in claim 5, 6 or 7, wherein in order to form the conductors, the entire surface of the substrate is coated with a photo-polymerisable material, the latter is selectively exposed to radiation so as to polymerise only the selected regions to act as conductors, and the uncured material is removed by an appropriate solvent.
Claim 10
Dependent Claim
29 words
A method as claimed in claim 8, wherein the photo-polymerisable material is exposed to curing radiation selectively by being scanned by a beam of electrons or coherent laser light.
Claim 11
Independent Claim
55 words
A method as claimed in any of claims 5 to 9, wherein the photo-polymerisable material comprises : 1. epoxy-acrylate prepolymer, supplied by UCB (Belgium) under trade name EBECRYL 600. 2. 1,6-Hexanediol acrylate (HDDA) 3. UVECRYL P36 photoinitiator, supplied by UCB (Belgium), 4. UVECRYL P104 photoactivator, supplied by UCB (Belgium), and 5. FC-430 (3M), wetting agent.
References Cited (Backward Citations)
No citation records indexed.
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