EP0109147A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Charged particle beam lithography machine incorporating localized vacuum envelope
Assignee: Varian Medical Systems Inc
•
Filing: 1983-09-08
•
Granted: —
•
Expires: 2003-09-08
Abstract
Abstract A charged particle beam lithography machine includes a beam source and beam steering and forming elements within an evacuated column (10). A stage assembly (30) for supporting a semiconductor wafer or mask is positioned in ambient and proximate the exit end of said beam steering and forming elements. A vacuum envelope apparatus (20) is affixed to the exit end of the beam steering and forming elements so that the outer surface or tip (23) of the vacuum envelope apparatus rests in spaced apart, close coupled opposition to the wafer or mask (28) supported on the stage. The vacuum envelope apparatus includes internal structural members (22) which define an internal vacuum processing zone and at least one surrounding intermediate vacuum zone (21). A graded vacuum seal is formed between the tip of the vacuum envelope and the mask or wafer. The seal extends from the internal vacuum processing zone to the external ambient. Lithographic operations are conducted on the mask or wafer as relative motion between the I stage assembly and beam steering and forming elements is accomplished.
Inventors
- 👤 Paul Francis Petric
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 17:13
CPC Classifications
B; B82; B82Y; B82Y10/00; B82Y40/00; H; H01; H01J; H01J37/00; H01J37/30; H01J37/301; H01J37/317; H01J37/3174; H01J2237/00; H01J2237/16; H01J2237/162; H01J2237/18; H01J2237/188; H01J2237/20
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
103 words
A charged particle beam lithography machine for applying patterns to semiconductor wafers or masks, comprising a beam source; beam steering and forming elements positioned downstream of said beam source; a stage assembly positioned adjacent the exit end of said beam steering and forming elements, said stage assembly providing a means for supporting said wafers or masks; and vacuum envelope apparatus attached to the exit end of said beam steering and forming elements between said beam steering and forming elements and said stage assembly, said vacuum envelope apparatus providing a vacuum at a local region of the surface of said semiconductor mask or wafer.
Claim 2
Dependent Claim
103 words
A charged particle beam lithography machine for applying patterns to semiconductor wafers or masks, comprising a beam source; beam steering and forming elements positioned downstream of said beam source; a stage assembly positioned adjacent the exit end of said beam steering and forming elements, said stage assembly providing a means for supporting said wafers or masks; and vacuum envelope apparatus attached to the exit end of said beam steering and forming elements between said beam steering and forming elements and said stage assembly, said vacuum envelope apparatus providing a vacuum at a local region of the surface of said semiconductor mask or wafer.
Claim 3
Dependent Claim
25 words
A charged particle beam lithography machine in accordance with claim 1 wherein said stage assembly moves with respect to said beam steering and forming elements.
Claim 4
Dependent Claim
123 words
A charged particle beam lithography machine in accordance with claim 2 wherein the internal structure of said vacuum envelope establishes an internal vacuum processing zone and at least one surrounding vacuum zone, said internal vacuum processing zone and said at least one surrounding vacuum zone comprising separate vacuum regions except that said internal vacuum processing zone and all of said at least one surrounding intermediate vacuum zones are exposed adjacent each other on the same surface of said vacuum envelope, such that when said surface is placed in close coupled opposition to said local region on the surface of said wafer or mask a graded vacuum seal is formed between the vacuum level in said internal vacuum processing zone and the ambient environment.
Claim 5
Dependent Claim
39 words
A machine as claimed in any one of claims 1 to 3 in combination with gap maintenance means (31,35,39) for maintaining within predetermined limits the gap between said vacuum envelope apparatus 23 and said semiconductor wafer or mask 28.
Claim 6
Dependent Claim
39 words
A machine as claimed in any one of claims 1 to 4 wherein said stage assembly includes means 96 to form a planar air bearing on its bottom, load bearing side for facilitating the lateral motion of said stage.
Claim 7
Dependent Claim
49 words
A machine as claimed in claim 5 wherein the surface of said bottom, load bearing side contains a network of supply holes and grooves which are connected through channels to air supply means 89 to thereby establish said planar air bearing in conjunction with the surface of a platen.
Claim 8
Dependent Claim
84 words
A machine as claimed in any one of claims 1 to 6 in combination with an alignment pad means positioned on said stage assembly coplanar with the surface of said wafer or mask and adjacent said wafer and mask so that during loading or off-loading of wafers or masks said stage may be moved to such a position that said vacuum envelope rests in spaced apart, close coupled opposition over said pad thereby retaining the vacuum in said vacuum envelope during loading and off-loading.
Claim 9
Dependent Claim
74 words
A machine as claimed in any one of claims 1 to 7 wherein the internal structure of said vacuum envelope apparatus further establishes an air supply zone which is exposed adjacent said at least one surrounding vacuum zone on said surface such that when said surface is placed in close coupled opposition to said local region on the surface of said wafer or mask, an air bearing is formed adjacent said graded vacuum seal.
Claim 10
Dependent Claim
28 words
A charged particle beam lithography machine in accordance with claim 8 wherein grooves are configured in said surface to conduct air from said air supply zone to ambient.
Claim 11
Dependent Claim
48 words
A charged particle beam lithography machine in accordance with claim 9 wherein said grooves comprise an annular groove displaced outwardly from the exposure of the outermost of said at least one intermediate vacuum zones and radial grooves extending between said annular groove and the periphery of said surface.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.