EP0107906A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Socket for integrated circuit
Assignee: Fujitsu Ltd
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Filing: 1983-09-21
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Granted: —
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Expires: 2003-09-21
Abstract
Abstract A socket for an integrated circuit (IC) comprises a box-shaped housing (12) of dielectric material which is open at its top and has a recess (12b) for receiving a leadless chip carrier type of IC device (10). A plurality of contacts (13), each comprising a springy conductive member, is disposed in the bottom of the housing so as to contact electrodes formed on the bottom surface of the IC device. A plurality of pressure members (14) is provided for holding the IC device within the recess, each member comprising a resilient portion (14a) and a projection (14b) formed at the top end of the resilient portion for pressing the IC device.
Inventors
- 👤 Tsutomu Yoshizaki
- 👤 Toshimasa Ishii
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 01:28
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; H05K7/1069
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
154 words
A socket for a leadless chip carrier integrated circuit (IC) device (10) which device has a plurality of electrodes (10a) formed on its bottom surface, the socket comprising a box-shaped housing (12) of dielectric material which is open at one side and has a recess (12b) for receiving the IC device, and a plurality of contacts (13) for making contact with the electrodes of the IC device within the recess; characterised in that each of the contacts (13) comprises a resilient conductive member and is disposed in the bottom of the housing so as to make contact with the electrodes formed on the bottom surface of the IC device; and in that a plurality of pressure members (14) is provided for holding the IC, device within the recess, each pressure member comprising a resilient member (14a) and a projection (14b) formed at a top end of the resilient member for pressing the IC device.
Claim 2
Dependent Claim
154 words
A socket for a leadless chip carrier integrated circuit (IC) device (10) which device has a plurality of electrodes (10a) formed on its bottom surface, the socket comprising a box-shaped housing (12) of dielectric material which is open at one side and has a recess (12b) for receiving the IC device, and a plurality of contacts (13) for making contact with the electrodes of the IC device within the recess; characterised in that each of the contacts (13) comprises a resilient conductive member and is disposed in the bottom of the housing so as to make contact with the electrodes formed on the bottom surface of the IC device; and in that a plurality of pressure members (14) is provided for holding the IC, device within the recess, each pressure member comprising a resilient member (14a) and a projection (14b) formed at a top end of the resilient member for pressing the IC device.
Claim 3
Dependent Claim
28 words
A socket as claimed in Claim 1, characterised in that the housing (12) has a respective partition (15) of dielectric material disposed between each two adjacent contacts (13).
Claim 4
Dependent Claim
25 words
A socket as claimed in Claim 1 or Claim 2, characterised in that the housing (12) has an opening (12a) formed in its bottom wall.
Claim 5
Dependent Claim
33 words
A socket as claimed in any preceding claim, characterised in that the end (13a) of each contact (13) constitutes a lead terminal which projects outwards from the bottom face of the housing (12).
Claim 6
Dependent Claim
49 words
A socket as claimed in any one of Claims 1-3, characterised in that the end (13a) of each contact (13) constitutes a lead terminal which is folded so as to be disposed on the outside of the bottom wall of the housing (12) and in contact with the housing.
References Cited (Backward Citations)
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