EP0107897A1
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EP
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Polyamino-bis-imide resin
Assignee: Resonac Corp
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Filing: 1983-09-08
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Granted: —
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Expires: 2003-09-08
Abstract
Abstract A curable polyamino-bis-imide resin is obtained by the thermal reaction of: (A) a bis-imide represented by the general formula I: wherein R, stands for a divalent organic group having a carbon-carbon double bond and R 2 for a divalent aromatic organic group having 1 to 3 benzene rings, with (B) a diamine represented by the general formula II: wherein X stands for one member selected from O, S, S0 2 , CH 2 , CO, COO, C(CH 3 ) 2 , CF 2 and C(CF 3 ) 2 , providing that the three X's may be identical to or different from one another and one or more of the hydrogen atoms attached to the benzene rings may be substituted by an inactive alkyl group, perfluoroalkyl group or halogen atom. Solutions thereof, cross-linked resins derived therefrom and laminated baords made from them are also described. Such laminated boards were found to have desirable heat resistance properties and were not susceptible to measling under test conditions.
Inventors
- 👤 Atsushi Fujioka
- 👤 Yasuo Miyadera
- 👤 Tomio Fukuda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 01:46
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/28; B32B15/00; B32B15/04; B32B15/08; B32B15/20; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/12; C08G73/126; B32B2305/00; B32B2305/08; B32B2305/72; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31681; Y10T428/31721
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
133 words
A curable polyamino-bis-imide resin characterised in that it is obtainable by the thermal reaction of: (A) a bis-imide represented by the general formula I: wherein R 1 stands for a divalent organic group having a carbon-carbon double bond and R 2 for a divalent aromatic organic group having 1 to 3 benzene rings, with (B) a diamine represented by the general formula II: wherein X stands for one member selected from O, S, SO 2 , CH 2 ,CO, COO, C(CH 3 ) 2 , CF 2 and C(CF 3 ) 2 , providing that the three X's may be identical to or- different from one another and one or more of the hydrogen atoms attached to the benzene rings may be substituted by an inactive alkyl group, perfluoroalkyl group or halogen atom.
Claim 2
Dependent Claim
133 words
A curable polyamino-bis-imide resin characterised in that it is obtainable by the thermal reaction of: (A) a bis-imide represented by the general formula I: wherein R 1 stands for a divalent organic group having a carbon-carbon double bond and R 2 for a divalent aromatic organic group having 1 to 3 benzene rings, with (B) a diamine represented by the general formula II: wherein X stands for one member selected from O, S, SO 2 , CH 2 ,CO, COO, C(CH 3 ) 2 , CF 2 and C(CF 3 ) 2 , providing that the three X's may be identical to or- different from one another and one or more of the hydrogen atoms attached to the benzene rings may be substituted by an inactive alkyl group, perfluoroalkyl group or halogen atom.
Claim 3
Dependent Claim
32 words
A curable polyamino-bis-imide resin according to Claim 1, characterised in that the bis-imide (A) is N,N'-4,4'-diphenylmethane-bis-maleimide and/or the diamine (B) is at least one member selected from 4,4'-di-(aminophenoxy)-diphenyl sulphones and 4,4'-di-(aminophenoxy)-diphenyl propanes.
Claim 4
Dependent Claim
36 words
A curable polyamino-bis-imide resin according to Claim 1 or 2, characterised in that the molar ratio of the bis-imide (A) to the diamine (B) is in the range of from 1: 0.1 to 1 : 1.
Claim 5
Dependent Claim
36 words
A curable polyamino-bis-imide resin according to any one of Claims 1 to 3,characterised in that the resin is obtained by carrying out the thermal reaction at a temperature in the range of from 100° to 200°C.
Claim 6
Dependent Claim
39 words
A curable polyamino-bis-imide resin according to any one of Claims 1 to 4, characterised in that the resin is obtained by carrying out the thermal reaction in an organic solvent selected from 2-methoxyethanol, 2-ethoxyethanol, 2-(metho x ymethoxy)-ethanol and 2-isopropoxyethanol.
Claim 7
Dependent Claim
38 words
A polyamino-bis-imide resin solution, obtained by dissolving a curable polyamino-bis- imide resin as claimed in any one of Claims 1 to 5 in an organic solvent having a boiling point in the range of from 70° to 160°C.
Claim 8
Dependent Claim
24 words
A polyamino-bis-imide resin solution according to Claim 6, wherein the organic solvent is at least one member selected from methylethyl ketone, 2-methoxyethanol and 2-ethcxyethanol.
Claim 9
Dependent Claim
66 words
A cross-linked resin characterised in that it is obtained by thermosetting a polyamino-bis-imide resin obtainable by the thermal reaction of (A) a bis-imide represented by the general formula I: wherein R 1 and R 2 have the same meanings as in Claim 1 above with (B) a diamine represented by the general formula II: wherein X has- the same meaning as described in Claim 1 above.
Claim 10
Dependent Claim
30 words
A cross-linked resin according to Claim 8, characterised in that the thermosetting of the polyamino-bis-imide resin is carried out at a temperature in the range of from 3.70° to 300°C.
Claim 11
Dependent Claim
27 words
A copper clad laminated board comprising a fibre reinforced cross-linked polyamino-bis-imide resin as claimed in any one of Claims 1 to 9 bonded to a copper foil.
References Cited (Backward Citations)
EP0047530A2
Cited
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