Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
121 words
A system for testing an electronic circuit wafer comprising a movable test head for housing at least one circuit card at which test signals are generated for testing the circuit wafer, characterised by a load/probe board (82) mounted in the test head, said board (82) having a plurality of probes (80), means securing the probes to the load/probe board at an inner area thereof so that the probes are positioned over the electronic circuit wafer, means (90, 92, 94) disposed over the load/probe board at an outer area thereof for providing electrical conductive connection from the circuit card (75) to the load/probe board (82), and electrical conductive circuit runs (97) on the load/probe board for providing electrical connection to the probes.
Claim 2
Independent Claim
121 words
A system for testing an electronic circuit wafer comprising a movable test head for housing at least one circuit card at which test signals are generated for testing the circuit wafer, characterised by a load/probe board (82) mounted in the test head, said board (82) having a plurality of probes (80), means securing the probes to the load/probe board at an inner area thereof so that the probes are positioned over the electronic circuit wafer, means (90, 92, 94) disposed over the load/probe board at an outer area thereof for providing electrical conductive connection from the circuit card (75) to the load/probe board (82), and electrical conductive circuit runs (97) on the load/probe board for providing electrical connection to the probes.
Claim 3
Dependent Claim
24 words
A system as claimed in claim 1, characterised in that the probes (80) are arranged radially about a centre hole in the load/probe board.
Claim 4
Dependent Claim
24 words
A system as claimed in claim 2, characterised in that the probes (80) are disposed extending from a top surface of the load/probe board.
Claim 5
Dependent Claim
23 words
A system as claimed in claim 3, characterised in that the circuit runs are disposed on a bottom surface of the load/probe board.
Claim 6
Dependent Claim
33 words
A system as claimed in claim 1, characterised in that apparatus (62, 64, 66, 68, 70) is provided for the adjustable positioning of the test head relative to a circuit wafer under test.
Claim 7
Dependent Claim
38 words
A system as claimed in claim 1, characterised in that the means disposed over the load/probe board (82) comprises a connector means (89) in the test head and connector means (90) between the test head and load/probe board.
Claim 8
Dependent Claim
35 words
A system as claimed in claim 6, characterised by connector pieceshaving upper and lower tabs (94A, 948) for providing electrical connection through the load/probe board from the second connector means (90) to the circuit means.
Claim 9
Dependent Claim
28 words
A system as claimed in claim 4, characterised in that the second connector means comprises a support boat (90) with a plurality of elastomer contacts (92) supported therein.
Claim 10
Independent Claim
24 words
A system as claimed in claim l,characterised in that the probes (80) are disposed extending from a bottom surface of the load/ probe board.
Claim 11
Dependent Claim
26 words
A system as claimed in claim 1, characterised in that the probes (80) are disposed extending from both top and bottom surfaces of the load/probe board.
Claim 12
Dependent Claim
23 words
A system as claimed in claim 1, characterised in that the circuit runs are disposed on the top surface of the load/probe board.
Claim 13
Dependent Claim
26 words
A system as claimed in claim 1, characterised in that the circuit runs are disposed on both top and bottom surfaces of the load/ probe board.
Claim 14
Dependent Claim
41 words
A system as claimed in claim 1, characterised in that the load/probe board is a multi-layer printed circuit board utilising micro-strip technology and having a characteristic impedance of each line from the test head pin electronics board to the probe blades.
Claim 15
Dependent Claim
80 words
A load/probe board for use in a testing system for an electronic circuit wafer, the board comprising a plurality of probes (80), means securing the probes to the board at an inner area thereof, means (94) disposed over the board at an outer area thereof for providing an electrical conductive connection from a circuit card (75) in the test system to the board and electrical conductive circuit runs (91 on the board for providing electrical connection to the probes (80).
Claim 16
Dependent Claim
80 words
A load/probe board for use in a testing system for an electronic circuit wafer, the board comprising a plurality of probes (80), means securing the probes to the board at an inner area thereof, means (94) disposed over the board at an outer area thereof for providing an electrical conductive connection from a circuit card (75) in the test system to the board and electrical conductive circuit runs (91 on the board for providing electrical connection to the probes (80).