EP0103025A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Pb ALLOY SOLDER FOR SEMICONDUCTOR DEVICE
Assignee: Mitsubishi Electric Corp
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Filing: 1983-03-02
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Granted: —
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Expires: 2003-03-02
Abstract
Abstract A Pb alloy solder which contains 1 to 65% by weight of one or both of Sn and in, the residue being composed of Pb and unavoidable impurities, with less than 50 ppb of radioisotopes as unavoidable impurities, so that a count of the number of radioactive alpha particles is less than 0.5 CPH/ cm 2 , thereby providing excellent bonding strength and wettability. 1 to 10% of Ag is also added to this solder to further improve the properties of the solder.
Inventors
- 👤 Naoyuki Hosoda
- 👤 Naoki Uchiyama
- 👤 Ryuusuke Kawanaka
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 20:14
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/262; H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; B23K35/268; H10W72/00; H10W72/20; H10W76/00; H10W76/60; H10W70/68; H10W70/682; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/352; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
52 words
A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt% of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more than 0.5 C P H/cm 2 .
Claim 2
Dependent Claim
52 words
A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt% of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more than 0.5 C P H/cm 2 .
Claim 3
Dependent Claim
58 words
A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt% of Sn or In or both and 1 to 10 wt% of Ag, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more than 0.5 CPH/ 2 cm .
Claim 4
Dependent Claim
58 words
A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt% of Sn or In or both and 1 to 10 wt% of Ag, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more than 0.5 CPH/ 2 cm .
References Cited (Backward Citations)
No citation records indexed.
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