EP0099092A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Series-parallel flow cooling apparatus
Assignee: Mitsubishi Electric Corp
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Filing: 1983-07-09
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Granted: —
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Expires: 2003-07-09
Abstract
Abstract A series-parallel flow cooling apparatus having both advantages in series and parallel flow systems which is obtained by combining a construction of series flow system with that of parallel flow system wherein a by-pass air duct (15) provided with an inlet (17) in a prescribed position is disposed in addition to a semiconductor cooling air duct (12), whereby temperatures of thyristor element junctions (3) are uniformalized, the cooling air flow is minimized, and reduction for power of whose auxiliary machineries is intended.
Inventors
- 👤 Susumu Kansai Electric Power Co. Inc. Matsumura
- 👤 Yasuhide C/O Mitsubishi Denki K.K. Takahashi
- 👤 Nobuyoshi C/O Mitsubishi Denki K.K. Takahashi
- 👤 Tohei C/O Mitsubishi Denki K.K. Nitta
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 18:02
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2089; H05K7/20909; H05K7/20009; H05K7/202
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
132 words
- A series-parallel flow cooling apparatus comprising: a tank provided with a feed port and an exhaust port for circulating a cooling gas; a plurality of modules being aligned vertically in said tank and involving semiconductors such as thyristor elements and the like; a semiconductor cooling air duct communicating with said modules and allowing said gas to flow thereinto to effect cooling of said semiconductors; a by-pass air duct being formed so as to communicate with said modules and communicating with said feed port for gas in said tank; and gas inlets each of which is defined on a side wall of said by-pass air duct being composed of said modules in a prescribed position and replenishing a fresh cooling gas supplied from said feed port into said semiconductor cooling air duct.
Claim 2
Dependent Claim
132 words
- A series-parallel flow cooling apparatus comprising: a tank provided with a feed port and an exhaust port for circulating a cooling gas; a plurality of modules being aligned vertically in said tank and involving semiconductors such as thyristor elements and the like; a semiconductor cooling air duct communicating with said modules and allowing said gas to flow thereinto to effect cooling of said semiconductors; a by-pass air duct being formed so as to communicate with said modules and communicating with said feed port for gas in said tank; and gas inlets each of which is defined on a side wall of said by-pass air duct being composed of said modules in a prescribed position and replenishing a fresh cooling gas supplied from said feed port into said semiconductor cooling air duct.
Claim 3
Dependent Claim
32 words
A series-parallel flow cooling apparatus as claimed in claim 1, wherein an opening is defined on a blind cap in the central part of a module insulating air duct of said module.
Claim 4
Dependent Claim
58 words
A series-parallel flow cooling apparatus as claimed in claim 2, wherein a throttle plate having an opening of a shape corresponding to that of the opening of said blind cap is disposed on the lower part of said module in order that area of the opening of said blind cap is regulated to obtain a suitable opening area.
Claim 5
Dependent Claim
35 words
A series-parallel flow cooling apparatus as claimed in claim 1, wherein said gas inlet is defined in such that a central air duct cell is permitted to communicate with cells formed on opposite sides thereof.
References Cited (Backward Citations)
No citation records indexed.
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