EP0099086A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Process for manufacturing copper-clad laminate and copper-clad laminate
Assignee: Arkray Inc
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Filing: 1983-07-08
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Granted: —
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Expires: 2003-07-08
Abstract
Abstract A process for manufacturing a cooper-clad laminate which includes a rolled copper foil as a circuit conductive material comprising, introducing a rolled copper foil through a power supply/guide roller into an electrolyte so as to pass between two parallel electrodes which are diposed in the electrolyte. An AC. DC or a combination thereof is supplied to the power supply/guide roller and the electrodes to form an etched layer on either one or both sides of the rolled copper foil. An adhesive is applied to the etched layer and the resultant rolled copper foil is pressed with a substrate made of a synthetic resin put together to form a laminate.
Inventors
- 👤 Osao C/O Hitachi Cable Ltd. Kamada
- 👤 Yoshiaki C/O Cable Labo. Matsuga
- 👤 Masami Kabushikigaisha Denkaihaku Kogyo Watase
- 👤 Tadato Kabushikigaisha Denkaihaku Kogyo Kudo
- 👤 Hiroyoshi Kabushikigaisha Denkaihaku Kogyo Harada
- 👤 Atsushi Kabushikigaisha Denkaihaku Kogyo Kanezaki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 03:42
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/383; B32B15/20; B32B3/00; B32B3/26; B32B7/00; B32B7/04; B32B7/12; B32B2260/00; B32B2260/04; B32B2260/046; B32B2307/00; B32B2307/20; B32B2307/202; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K3/02; H05K3/06; H05K3/07; H05K3/386
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
120 words
A process for manufacturing a copper-clad laminate which includes a rolled copper foil as a circuit conductive material, comprising the steps of: preparing a tank filled with an electrolyte in which two parallel electrodes are disposed; introducing a rolled copper foil through a power supply/guide roller into said electrolyte so as to pass between said two electrodes under current supply from a power source to said electrodes and said power supply/guide roller to form an etched layer on surfaces of said rolled copper foil; applying an adhesive on the etched layer of said rolled copper foil; and then pressing said rolled copper foil with a substrate made of a synthetic resin impregnated substrate put together to form a copper-clad laminate.
Claim 2
Dependent Claim
120 words
A process for manufacturing a copper-clad laminate which includes a rolled copper foil as a circuit conductive material, comprising the steps of: preparing a tank filled with an electrolyte in which two parallel electrodes are disposed; introducing a rolled copper foil through a power supply/guide roller into said electrolyte so as to pass between said two electrodes under current supply from a power source to said electrodes and said power supply/guide roller to form an etched layer on surfaces of said rolled copper foil; applying an adhesive on the etched layer of said rolled copper foil; and then pressing said rolled copper foil with a substrate made of a synthetic resin impregnated substrate put together to form a copper-clad laminate.
Claim 3
Dependent Claim
28 words
A process in claim 1, wherein said etched layer comprises pores formed thereon, said pores each having a depth in a range from 0.5 µm to 10 µm.
Claim 4
Dependent Claim
40 words
A process in claim 1, wherein said power source .comprises DC power supply means with a positive terminal of said DC power supply means connecting to said power supply/ guide roller while an negative terminal connecting to said two electrodes.
Claim 5
Dependent Claim
14 words
A process in claim 1, wherein said power source comprises AC power supply means.
Claim 6
Dependent Claim
19 words
A process in claim 1, wherein said power source comprises a combination of AC and DC power supply means.
Claim 7
Dependent Claim
14 words
A process in claim 1, wherein said roller copper foil comprises oxygen free copper.
Claim 8
Dependent Claim
40 words
A process in claim 1, wherein said rolled copper foil is belt-shaped and wherein at least one sheet of said belt-shaped rolled copper foil is continuously carried lengthwise and an etched surface is simultaneously formed in the course of carriage.
Claim 9
Dependent Claim
39 words
A process in claim 1, wherein said rolled copper foil is belt-shaped and wherein two lapping sheets of said belt-shaped rolled copper foils are continuously carried lengthwise and an etched surface is simultaneously formed in the course of carriage.
Claim 10
Dependent Claim
113 words
A process for manufacturing a copper-clad laminate which includes a rolled copper foil as a circuit conductive material, comprising the steps of preparing a tank filled with an electrolyte in which two parallel electrodes are disposed; introducing a rolled copper foil through a power supply/guide roller into said electrolyte so as to pass between said electrodes under supply of AC current to said two electrodes to form an etched layer on surfaces of said rolled copper foil; applying an adhesive on the etched layer of said rolled copper foil; and then pressing said rolled copper foil with a substrate made of a synthetic resin impregnated substrate put together to form a copper-clad laminate.
Claim 11
Dependent Claim
113 words
A process for manufacturing a copper-clad laminate which includes a rolled copper foil as a circuit conductive material, comprising the steps of preparing a tank filled with an electrolyte in which two parallel electrodes are disposed; introducing a rolled copper foil through a power supply/guide roller into said electrolyte so as to pass between said electrodes under supply of AC current to said two electrodes to form an etched layer on surfaces of said rolled copper foil; applying an adhesive on the etched layer of said rolled copper foil; and then pressing said rolled copper foil with a substrate made of a synthetic resin impregnated substrate put together to form a copper-clad laminate.
Claim 12
Dependent Claim
28 words
A process in claim 9, wherein said etched layer comprises pores formed thereon, said pores each having a depth in a range from 0.5 µm to 10 µm.
Claim 13
Dependent Claim
14 words
A process in claim 9, wherein said rolled copper foil comprises oxygen free copper.
Claim 14
Dependent Claim
40 words
A process in claim 9, wherein said rolled copper foil is belt-shaped and wherein at least one sheet of said belt-shaped rolled copper foil is continuously carried lengthwise and an etched surface is simultaneously formed in the course of carriage.
Claim 15
Dependent Claim
39 words
A process in claim 9, wherein said rolled copper foil is belt-shaped and wherein two lapping sheets of said belt-shaped rolled copper foils are continuously carried lengthwise and an etched surface is simultaneously formed in the course of carriage.
References Cited (Backward Citations)
No citation records indexed.
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