EP0098051A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A plastics-encapsulated circuit element
Assignee: Toshiba Corp
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Filing: 1983-05-31
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Granted: —
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Expires: 2003-05-31
Abstract
Abstract A high voltage circuit element (16) is connected with a number of external leads (19, 21, 22) which are close to one another. The assembly is enclosed in a plastic encapsulation (26), the surface of which is stepped (28) between adjacent leads (19, 21 and 21, 22) in order to increase the surface path between the leads.
Inventors
- 👤 Mitsuru C/O Patent Division Yasui
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 17:58
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W70/00; H10W70/40; H10W70/481; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
81 words
A plastic encapsulated device comprising a circuit element (16) having a plurality of terminals; leads (19, 21, 22) connected with the terminals of the element (16); and a plastic encapsulation (26) enclosing the element (16) and a part of each lead (19, 21, 22); characterised in that the surface of the encapsulation (26) has a step (28 or 29) adjacent at least one of the leads (19, 21, 22) in order to increase the leakage path from the lead or leads.
Claim 2
Dependent Claim
81 words
A plastic encapsulated device comprising a circuit element (16) having a plurality of terminals; leads (19, 21, 22) connected with the terminals of the element (16); and a plastic encapsulation (26) enclosing the element (16) and a part of each lead (19, 21, 22); characterised in that the surface of the encapsulation (26) has a step (28 or 29) adjacent at least one of the leads (19, 21, 22) in order to increase the leakage path from the lead or leads.
Claim 3
Dependent Claim
41 words
A plastic encapsulated device according to claim 1, in which the leads (19, 21, 22) are closely arranged and a step (28) is formed in the surface of the encapsulation between at least two adjacent leads (19, 21 and/or 19, 22).
Claim 4
Dependent Claim
37 words
A plastic encapsulated device according to claim 2, in which the or each step is constituted by a groove (33, 34) in the surface of the encapsulation (26) between two adjacent leads (18, 21 and 18, 22).
Claim 5
Dependent Claim
47 words
A plastic encapsulated device according to claim 1, in which the encapsulation (26) has two opposing surfaces connected by side surfaces, from one of which the leads (19, 21, 22) extend and a step (29) is formed between that side surface and one of the opposing surfaces.
Claim 6
Dependent Claim
24 words
A plastic encapsulated device according to claim 4, in which the encapsulation has additionally a step (28) according to claim 2 or claim 3.
Claim 7
Dependent Claim
27 words
A plastic encapsulated device according to claim 4, in which the leads (19, 21, 22) extend from the side surface adjacent to one of the opposing surfaces.
Claim 8
Dependent Claim
38 words
A plastic encapsulated device according to any one of the preceding claims, in which the element (16) is a transistor and the leads (19, 21, 22) are respectively connected with the emitter, base and collector of the transistor.
Claim 9
Dependent Claim
26 words
A plastic encapsulated device according to claim 7, in which a step (28) is formed between the leads (18, 21) connected with the base and collector.
Claim 10
Dependent Claim
32 words
A plastic encapsulated device according to any one of the preceding claims, in which a mounting hole (27) is formed in the encapsulation (26) for installing the device on an external plate.
References Cited (Backward Citations)
No citation records indexed.
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