Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
119 words
A packaging substrate for integrated circuits including a fan-out metallurgical structure formed near the surface of the substrate, said metallurgy comprising first connection regions to the substrate can be made, second solder connection regions (18: 28: 38: 48) to which connections can also be made by soldering and third solderless connection regions (17: 27: 37: 47) to which connections can be made by thermal bonding solderlessly, the surface of the second solder bonding regions (18: 28: 38: 48) comprising a metal selected from the group consisting of Au, Cu and Ni and the surfaces of the third, solderless bonding regions (17: 27: 37: 47) comprising a metal selected from the group consisting of Au, Cr, Ti, Al and Co.
Claim 2
Dependent Claim
119 words
A packaging substrate for integrated circuits including a fan-out metallurgical structure formed near the surface of the substrate, said metallurgy comprising first connection regions to the substrate can be made, second solder connection regions (18: 28: 38: 48) to which connections can also be made by soldering and third solderless connection regions (17: 27: 37: 47) to which connections can be made by thermal bonding solderlessly, the surface of the second solder bonding regions (18: 28: 38: 48) comprising a metal selected from the group consisting of Au, Cu and Ni and the surfaces of the third, solderless bonding regions (17: 27: 37: 47) comprising a metal selected from the group consisting of Au, Cr, Ti, Al and Co.
Claim 3
Dependent Claim
23 words
A substrate as claimed in claim 1 wherein the base metallurgy (layer 11: 21: 31: 41) of the conductor comprises Cr or Ti.
Claim 4
Dependent Claim
54 words
A substrate in accordance with claim 2 wherein the second layer (12: Fig. 1) comprises Cu and the third layer comprises Cr with the succeeding layers (14, 15, 16) comprising Cr, Cu and Au with the layer of Au on the surface adapted for inclusion in the solder and solderless surface regions (18, 17).
Claim 5
Dependent Claim
60 words
A substrate as claimed in claim 2 wherein the second layer (22: Fig. 2) comprises Cu, the third layer (23) comprises Cr, the fourth layer (24) comprises Cr and Cu in that order and the upper layer (26) comprises Cr or Ti with the upper layer of Cr or Ti removed in the surface areas of the second regions (28).
Claim 6
Dependent Claim
60 words
A substrate as claimed in claim 2 wherein the second layer (32: Fig. 3.1) comprises Cu, the third layer (33) comprises Cr, the fourth layer (34) comprises Cr and Cu in that order and a fifth layer (35) of Cu with the Cu removed in the solderless bonding regions (37) leaving Cu for solder bonding in the solder bonding region.
Claim 7
Dependent Claim
49 words
A substrate as claimed in claim 2 wherein said second layer (32': Fig. 3.2) comprises Al, and the third layer (35') comprises Ni with the solder bonding region being (38) the exposed surfaces of said third layer, and the solderless bonding regions (37) comprising openings to said second layer.
Claim 8
Dependent Claim
82 words
A substrate as claimed in claim 2 wherein the second layer (32: Fig. 3.3) is composed of copper or gold, the third layer (33) is composed of Cr or Co and the fourth layer (35') is composed of Ni or Cu with the solder bonding regions (38) being formed by the surface of said fourth layer (35') and the solderless bonding regions (37) being formed by the surface of said third layer in areas thereof exposed through openings in the fourth layer.
Claim 9
Dependent Claim
72 words
A substrate in accordance with claim 2 wherein the second layer (42: Fig. 4.1) is composed of Cu, the third layer (43) is composed of Cr which is exposed in the solderless bonding regions (47) of the structure, with at least one opening made for the solder bonding regions (48) in a coating layer (49) into which is deposited a metallic layer (44) comprising Cr covered with a layer (45) of Cu.
Claim 10
Dependent Claim
79 words
A substrate in accordance with claim 2 wherein the second layer (42': Fig. 4.2) is composed of Al, alloys of Al or Au and the solderless bonding regions (47) are formed by areas of the second layer exposed through openings down to the second layer formed in a coating layer (49), the layer (49) having other openings with a layer (45') of Ni, Cu, Pd or Pt deposited into said other openings to form the solder bonding regions (48).
Claim 11
Dependent Claim
74 words
A substrate in accordance with claim 2 wherein the second layer (42: Fig. 4.3) is composed of Cu, the third layer (42) is composed of Cr or Co, and the solderless bonding regions (47) are formed on the surface of said third layer, with the solder bonding areas formed by deposition of a layer (45") of Ni or Cu on the third layer in the desired areas, through openings in a dielectric coating area.