Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
73 words
A semiconductor device comprising emitter, base and collector regions, characterised in that said emitter region has an energy gap of a first magnitude and forms a first junction with a base region having an energy gap of a second magnitude narrower than said emitter energy gap, said collector region forming a second junction with said base region and said base energy gap decreasing with distance from said first junction to said second junction.
Claim 2
Dependent Claim
73 words
A semiconductor device comprising emitter, base and collector regions, characterised in that said emitter region has an energy gap of a first magnitude and forms a first junction with a base region having an energy gap of a second magnitude narrower than said emitter energy gap, said collector region forming a second junction with said base region and said base energy gap decreasing with distance from said first junction to said second junction.
Claim 3
Dependent Claim
19 words
A semiconductor device as claimed in claim 1, in which said regions are epitaxial layers formed on a substrate.
Claim 4
Dependent Claim
153 words
A semiconductor device as claimed in claim 2, in which said emitter layer is of A 1-x D x B ingredients, said base layer is of A 1-x C x B ingredients, the band gap of the semiconductor of AB ingredients being greater than the band gap of the semiconductor of CB ingredients and where the lattice constant of said semiconductor A 1-x D x B is essentially equal to the lattice constant of said semiconductor A 1-x C x B at the emitter-base junction and where 0 < x < 1 and x increases with distance from said emitterbase junction at the interface of said emitter and said base layers, said collector layer being of A l-x C x B ingredients where the value of x decreases with distance from the base-collector junction at the interface between said base and collector layers and said substrate layer being of A and B ingredients.
Claim 5
Dependent Claim
23 words
A semiconductor device as claimed in claim 3, in which A is Ga, D is Al, C is In and B is As.
Claim 6
Independent Claim
167 words
A method of forming a semiconductor device characterised in that the method comprises the steps of providing a substrate layer of n conductivity type monocrystalline AB semiconductor material having two essentially parallel broad area surfaces, forming on a first said broad area surface to be exposed to an optical signal an epitaxial collector layer of A 1-x C x B wherein x increases with distance from said substrate layer, forming on said collector layer an epitaxial base layer forming a base-collector p-n junction with said base layer, said base layer being of A 1-x C x B semiconductor material wherein x decreases with distance from said p-n junction, forming an emitter epitaxial layer on said base layer at an emitter-base p-n junction, said emitter layer being of A 1-x D x B semiconductor material having a higher band gap and lattice matched to said base semiconductor material at said emitter-base p-n junction, and applying an electrical contact to each said substrate, said base and said emitter layers.
Claim 7
Independent Claim
167 words
A method of forming a semiconductor device characterised in that the method comprises the steps of providing a substrate layer of n conductivity type monocrystalline AB semiconductor material having two essentially parallel broad area surfaces, forming on a first said broad area surface to be exposed to an optical signal an epitaxial collector layer of A 1-x C x B wherein x increases with distance from said substrate layer, forming on said collector layer an epitaxial base layer forming a base-collector p-n junction with said base layer, said base layer being of A 1-x C x B semiconductor material wherein x decreases with distance from said p-n junction, forming an emitter epitaxial layer on said base layer at an emitter-base p-n junction, said emitter layer being of A 1-x D x B semiconductor material having a higher band gap and lattice matched to said base semiconductor material at said emitter-base p-n junction, and applying an electrical contact to each said substrate, said base and said emitter layers.
Claim 8
Dependent Claim
34 words
A method as claimed in claim 5, in which the substrate is GaAs semiconductor material, base and collector layers are Ga 1-x In x As and the emitter is Ga 1-x Al x As.