EP0092428A2
Expired / Lapsed
EP
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A method for producing a piezoelectric resonator
Assignee: Fujitsu Ltd
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Filing: 1983-04-19
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Granted: —
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Expires: 2003-04-19
Abstract
Abstract A piezoelectric resonator comprises a base plate 24 with a strip-type, energy trapping-type piezoelectric resonator chip 22 mounted on it. The piezoelectric resonator chip 22 comprises a piezoelectric chip plate 26 and a pair of electrode patterns 27, 27' formed on opposed main surfaces of the piezoelectric chip plate 22. One main surface of the piezoelectric chip plate 22 faces the base plate 24 and is parallel to it and a conductive layer 28', 29' is formed on each end of the main surface of the chip plate 22 facing the base plate 24. The thickness of the conductive layer 28', 29', is thicker than that of the electrode pattern 27 so that the electrode pattern is not in contact with the base plate 24. The conductive layer 28', 29', is directly mounted on a conductive portion 32, 33 of the base plate 24 to electrically connect the electrode pattern 27, 27' and the conductive portion 32, 33, of the base plate 24.
Inventors
- 👤 Sumio Yamada
- 👤 Yoshiro Fujiwara
- 👤 Yuji Kojima
- 👤 Hiroshi Hoshino
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 15:14
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/15; H03H9/17; H03H9/177; H03H3/00; H03H3/007; H03H3/02; H03H9/02; H03H9/05; H03H9/10; H03H9/1007; H03H9/1014; Y; Y10; Y10T; Y10T29/00; Y10T29/42; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
160 words
A piezoelectric resonator comprising a base plate (24) and a strip-type, energy trapping-type piezoelectric resonator chip (22) mounted on the base plate, the piezoelectric resonator chip (22) comprising a piezoelectric chip plate (26) and a pair of electrode patterns (27, 27') formed on opposite main surfaces of the piezoelectric chip plate (22), characterised in that one main surface of the piezoelectric chip plate faces the base plate (24) and is parallel to it and in that a conductive layer (28', 29') is formed on each end of the main surface facing the base plate (24), the thickness of the conductive layer (28', 29')being thicker than that of the electrode pattern (27') so that the electrode pattern (27') is separated from the base plate (24), the conductive layer (28', 29') being directly mounted on conductive portions (32,33) of the base plate (24) to electrically connect the electrode patterns (27, 27') and the conductive portions (32, 33) of the base plate (24).
Claim 2
Dependent Claim
160 words
A piezoelectric resonator comprising a base plate (24) and a strip-type, energy trapping-type piezoelectric resonator chip (22) mounted on the base plate, the piezoelectric resonator chip (22) comprising a piezoelectric chip plate (26) and a pair of electrode patterns (27, 27') formed on opposite main surfaces of the piezoelectric chip plate (22), characterised in that one main surface of the piezoelectric chip plate faces the base plate (24) and is parallel to it and in that a conductive layer (28', 29') is formed on each end of the main surface facing the base plate (24), the thickness of the conductive layer (28', 29')being thicker than that of the electrode pattern (27') so that the electrode pattern (27') is separated from the base plate (24), the conductive layer (28', 29') being directly mounted on conductive portions (32,33) of the base plate (24) to electrically connect the electrode patterns (27, 27') and the conductive portions (32, 33) of the base plate (24).
Claim 3
Dependent Claim
26 words
A piezoelectric resonator according to claim 1, .in which a cap (23) sealingly encloses the resonator chip (22) and is attached to the base plate (24).
Claim 4
Independent Claim
214 words
A method of producing a piezoelectric resonator which comprises a base plate (24) and a strip-type, energy trapping-type piezoelectric resonator chip (22) mounted on the base plate (24), the method comprising: forming a plurality of electrode patterns, each electrode pattern comprising an electrode main portion, and a connecting portion, on upper and lower surfaces of a wafer of piezoelectric material; forming a first conductive pattern on the connecting portion of the electrode pattern on one surface of the wafer and a second conductive pattern on the other surface of the wafer, the thickness of the first and second conductive patterns being greater than that of the electrode pattern; forming a first groove for cutting the wafer on and along the conductive patterns; coating the inner surface of the groove with a conductive material to electrically interconnect the first and second conductive patterns; cutting the wafer along the first groove and along second grooves perpendicular to the first groove to divide the wafer into a plurality of piezoelectric resonator chips each having conductive layers comprising the first and second conductive patterns; and, directly mounting a piezoelectric resonator chip so formed on a base plate with the conductive layer of the piezoelectric resonator chip contacting a conductive portion formed on the surface of the base plate.
Claim 5
Independent Claim
214 words
A method of producing a piezoelectric resonator which comprises a base plate (24) and a strip-type, energy trapping-type piezoelectric resonator chip (22) mounted on the base plate (24), the method comprising: forming a plurality of electrode patterns, each electrode pattern comprising an electrode main portion, and a connecting portion, on upper and lower surfaces of a wafer of piezoelectric material; forming a first conductive pattern on the connecting portion of the electrode pattern on one surface of the wafer and a second conductive pattern on the other surface of the wafer, the thickness of the first and second conductive patterns being greater than that of the electrode pattern; forming a first groove for cutting the wafer on and along the conductive patterns; coating the inner surface of the groove with a conductive material to electrically interconnect the first and second conductive patterns; cutting the wafer along the first groove and along second grooves perpendicular to the first groove to divide the wafer into a plurality of piezoelectric resonator chips each having conductive layers comprising the first and second conductive patterns; and, directly mounting a piezoelectric resonator chip so formed on a base plate with the conductive layer of the piezoelectric resonator chip contacting a conductive portion formed on the surface of the base plate.
Claim 6
Dependent Claim
22 words
A method according to claim 3, which further comprises attaching a cap onto the base plate to cover the piezoelectric resonator chip.
Claim 7
Dependent Claim
68 words
A method according to claim 3 or 4, in which the first and second grooves are formed after the wafer is bonded to an expansible adhesive tape, the first groove being filled with a conductive paste and the tape subsequently being expanded to widen the first groove and thereby separate the conductive paste so that the inner surface of the first groove is coated with the conductive paste.
References Cited (Backward Citations)
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