EP0092292A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of and device for placing chip-type electrical and/or electronic components on a substrate
Assignee: Koninklijke Philips NV
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Filing: 1983-04-19
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Granted: —
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Expires: 2003-04-19
Abstract
Abstract A method of and a device for placing chip-type components (2) on a substrate (1), in which a number of components (2) are simultaneously picked up in presentation positions by means of a pick-up device (10) which comprises a number of pick-up elements (12), after which the pick-up device (10) is moved to a position over the substrate (1) and each of the pick-up elements (12) in succession is moved to a position over the desired position on the substrate by movement of the pick-up device and/or the substrate with respect to one another, after which the relevant component is deposited and released in the relevant position by the pick-up element.
Inventors
- 👤 Hendrik Cornelis Wardenaar
- 👤 Bernardus Johannes Kuppens
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 04:28
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/50; H05; H05K; H05K13/00; H05K13/04; H05K13/0404; H05K13/0408; H05K13/041; H05K13/0015; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53178
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
115 words
A method of placing chip-type electrical and/or electronic components on a substrate, in which a number of components are simultaneously picked up in presentation positions by means of a pick-up device which comprises a number of pick-up elements, after which the pick-up device is moved to a position over the substrate, characterized in that by movement of the pick-up device and/or the substrate with respect to one another, each of thepick-up elements or groups of pick-up elements in succession is moved to a position (positions) over the relevant desired position (positions) on the substrate, after which the relevant component (components) is (are) deposited and released in the relevant position (positions) by the pick-up element (elements).
Claim 2
Independent Claim
115 words
A method of placing chip-type electrical and/or electronic components on a substrate, in which a number of components are simultaneously picked up in presentation positions by means of a pick-up device which comprises a number of pick-up elements, after which the pick-up device is moved to a position over the substrate, characterized in that by movement of the pick-up device and/or the substrate with respect to one another, each of thepick-up elements or groups of pick-up elements in succession is moved to a position (positions) over the relevant desired position (positions) on the substrate, after which the relevant component (components) is (are) deposited and released in the relevant position (positions) by the pick-up element (elements).
Claim 3
Dependent Claim
40 words
A method as claimed in Claim 1, characterized in that the sequence in which the pick-up elements are successively positioned over the relevant substrate positions is chosen so that the distance to be travelled is always as short as possible.
Claim 4
Dependent Claim
48 words
A method as claimed in Claim 1 or 2, characterized in that after picking up the components the pick-up device is first moved to a position over an adhesive-applying device which comprises a number of adhesive-applying members which are arranged in the same pattern as the presentation positions.
Claim 5
Dependent Claim
42 words
A method as claimed in Claim 1, 2 or 3, characterized in that the pick-up device and/or the substrate are or is moved by means of a drive which is controlled in accordance with a program which also controls the pick-up elements.
Claim 6
Dependent Claim
33 words
A method as claimed in Claim 1, 2 or 3, characterized in that the pick-up device and/or the substrate are or is controlled by means of a pantograph which scans a specimen substrate.
Claim 7
Independent Claim
195 words
A device for placing chip-type electrical and/or electronic components on a substrate by means of the method claimed in one or more of the preceding Claims, comprising a movable pick-up device which comprises a number of pick-up elements, which are arranged in a given pattern, said pick-up device being movable to a position over a number of positions in which the components are presented and in which a component can be picked up by each of the pick-up elements, and subsequently being movable by drive means to a position over a substrate support, characterized in that the device comprises two mutually perpendicular guides on which the pick-up device can move in a first direction from a position over the presentation positions to a position over the substrate support, the pick-up device or the substrate support being movable in a direction perpendicular to the first direction so that each of the pick-up elements or groups of pick-up elements in succession can be positioned over the relevant position (positions) on the substrate, in which position (positions) each of the pick-up elements or groups of pick-up elements can separately place and release its component (components) on the substrate.
Claim 8
Dependent Claim
34 words
A device as claimed in Claim 6, characterized in that the pick-up device is carried by two carriages which are movable in mutually perpendicular directions and each of which is coupled to a drive.
Claim 9
Dependent Claim
26 words
A device as claimed in Claim 7, characterized in that the drives and the pick-up elements are arranged to be controlled by means of a program.
Claim 10
Dependent Claim
32 words
A device as claimed in Claim 7, characterized in that the drives and the pick-up elements are arranged to be controlled by means of a pantograph which can scan a specimen substrate.
Claim 11
Dependent Claim
25 words
A device as claimed in Claim 6, 7, 8 or 9, characterized in that all the pick-up elements are arranged in one or more rows.
Claim 12
Dependent Claim
28 words
A device as claimed in Claim 10, characterized in that the distance between the elements in the or each row equals half the distance between the presentation positions.
References Cited (Backward Citations)
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