EP0090608A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor device with moulded package
Assignee: Fujitsu Ltd
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Filing: 1983-03-24
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Granted: —
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Expires: 2003-03-24
Abstract
Abstract A semiconductor device with a package (15) moulded from plastics material includes a plurality of open-ended channels (17) which are spaced a predetermined distance from each other in the lower outer corner of the package at positions corresponding to those of a plurality of external leads (16). The external leads (16) are folded, with their tips (16b) positioned in the channels (17) and the middle portions (16a) of the external leads located above the base (18, 22, 22') of the package so that a predetermined standoff distance (SO) is maintained between them.
Inventors
- 👤 Akihiro Kubota
- 👤 Tsuyoshi Aoki
- 👤 Michio Ono
- 👤 Rikio Sugiura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 17:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
124 words
A semiconductor device comprising a main body (15) formed by moulding from a plastics material and a plurality of outer leads (16) extending out of the main body (15), the main body (15) having a base (18, 22, 22') and a plurality of sides (19) from which the outer leads (15) extend, the main body including recesses (6) and the outer leads (16) being bent so that their tips are located in the recesses (6) characterised in that the recesses are formed as channels (17) opening to the sides (19) and to the base (18, 22, 22'), middle portions of the outer leads (16a) being spaced away from the base (18, 22, 22') so that a predetermined standoff (SO) distance is maintained between them.
Claim 2
Dependent Claim
124 words
A semiconductor device comprising a main body (15) formed by moulding from a plastics material and a plurality of outer leads (16) extending out of the main body (15), the main body (15) having a base (18, 22, 22') and a plurality of sides (19) from which the outer leads (15) extend, the main body including recesses (6) and the outer leads (16) being bent so that their tips are located in the recesses (6) characterised in that the recesses are formed as channels (17) opening to the sides (19) and to the base (18, 22, 22'), middle portions of the outer leads (16a) being spaced away from the base (18, 22, 22') so that a predetermined standoff (SO) distance is maintained between them.
Claim 3
Dependent Claim
30 words
A semiconductor device according to claim 1, wherein each of the channels (17) is only open at one end and has a bottom end corner (17') opposite its open end.
Claim 4
Dependent Claim
23 words
A semiconductor device according to claim 1, in which the channels are open ended with both ends being open (Figures 6 and 7).
Claim 5
Dependent Claim
138 words
A resin-molded semiconductor device comprising a resin-molded main body and a plurality of outer leads extending out of the main body , the main body having a main surface and a plurality of side surfaces from which the outer leads extend, the main body having a plurality of grooves which are spaced a predetermined distance from each other in the corner portions defined by the main surface and the side surfaces of the main body, each of said grooves opening at said main surface and at one of said side surfaces and corresponding to each of said external leads respectively, said external leads being bent, the tips of said external leads being positioned in said grooves, and the middle portions of said external leads being located above said main surface so that a predetermined standoff distance is maintained.
Claim 6
Dependent Claim
138 words
A resin-molded semiconductor device comprising a resin-molded main body and a plurality of outer leads extending out of the main body , the main body having a main surface and a plurality of side surfaces from which the outer leads extend, the main body having a plurality of grooves which are spaced a predetermined distance from each other in the corner portions defined by the main surface and the side surfaces of the main body, each of said grooves opening at said main surface and at one of said side surfaces and corresponding to each of said external leads respectively, said external leads being bent, the tips of said external leads being positioned in said grooves, and the middle portions of said external leads being located above said main surface so that a predetermined standoff distance is maintained.
References Cited (Backward Citations)
No citation records indexed.
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