EP0090503A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Apparatus and method of packaging a semiconductor device
Assignee: Texas Instruments Inc
•
Filing: 1983-03-01
•
Granted: —
•
Expires: 2003-03-01
Abstract
Abstract A method of packaging a semiconductor device during which leads (312, 313) are lanced from a bar pad (3/7) of the ead frame (310). The leads (312, 313) of the lead frame (310) remain within one plane and the bar pad (317) is displaced to a different plane in order to provide the necessary separation between the ends of the leads (312, 313) and the bar pad (317) to prevent accidental connections. A region of reduced mechanical strength is provided laterally across each lead to allow the leads to be bent after the smiconductor device and the portions of the leads adjacent to the semiconductor device are encapsulated with a plastic enclosure. At least some leads have an enlarged area within the encapsulated portion of the leads to secure and anchor the leads within the plastic forming the encapsulating enclosure.
Inventors
- 👤 John W. Orcutt
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 16:47
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/048; H10W70/40; H10W70/421; H10W74/00; H10W74/10; H10W74/111; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
57 words
A method of producing a lead frame comprising the steps of: (a) forming a substantially flat, metallic frame with a centrally disposed bar pad and at least one lead attached at one end to said bar pad and extending away from said bar pad to another opposite end; and (b) lancing said lead from said bar pad.
Claim 2
Independent Claim
57 words
A method of producing a lead frame comprising the steps of: (a) forming a substantially flat, metallic frame with a centrally disposed bar pad and at least one lead attached at one end to said bar pad and extending away from said bar pad to another opposite end; and (b) lancing said lead from said bar pad.
Claim 3
Dependent Claim
43 words
Method as set forth in Claim 1, including the step of after step b, displacing said bar pad relative to said lead with said bar pad within a first plane and said lead within a second plane substantially parallel to said first plane.
Claim 4
Dependent Claim
95 words
A package for a semiconductor device comprising: (a) a plastic enclosure surrounding said semiconductor device and having an exterior surface; (b) a bar pad attached to said semiconductor device and located in a first plane within said plastic enclosure and having an edge; (c) at least one lead extending from a first end located within said enclosure in a second plane substantially parallel to said first plane through said exterior surface to a second end thereof, said edge and said one end located within a third plane substantially perpendicular to said first and second planes.
Claim 5
Dependent Claim
95 words
A package for a semiconductor device comprising: (a) a plastic enclosure surrounding said semiconductor device and having an exterior surface; (b) a bar pad attached to said semiconductor device and located in a first plane within said plastic enclosure and having an edge; (c) at least one lead extending from a first end located within said enclosure in a second plane substantially parallel to said first plane through said exterior surface to a second end thereof, said edge and said one end located within a third plane substantially perpendicular to said first and second planes.
Claim 6
Dependent Claim
27 words
Package as set forth in Claim 3 wherein said lead has a narrow lateral region of reduced mechanical strength located outside said enclosure adjacent said exterior surface.
Claim 7
Dependent Claim
22 words
Package as set forth in Claim 4 wherein said lead is bent from said second plane along said region outside said enclosure.
Claim 8
Dependent Claim
22 words
Package as set forth in Claim 3 including an electrical connection between said lead and said semiconductor device within said enclosure. r
Claim 9
Dependent Claim
35 words
Package as set forth in Claim 6 wherein said electrical connection includes a wire extending from a contact pad on said semiconductor device to a contact pad on said lead adjacent said one end thereof.
Claim 10
Dependent Claim
27 words
Package as set forth in Claim 3 wherein said lead is provided with an enlarged area of increased width within said enclosure to secure said lead therein.
Claim 11
Dependent Claim
132 words
A package for a semiconductor device comprising: (a) a plastic enclosure surrounding said semiconductor device and having exterior surface; (b) a bar pad attached to said semiconductor device and located in a first plane within said enclosure; (c) at least one lead extending from one end adjacent said bar pad within said enclosure through said exterior surface to another end, said lead including a first and second portions thereof, said first portion extending within said first plane from said exterior surface to said second portion, said second portion having a length of a certain distance including said one end and extending away from said first plane and toward said bar pad, said first portion being spaced, at the end thereof away from said exterior surface, from said bar pad said certain distance.
Claim 12
Dependent Claim
132 words
A package for a semiconductor device comprising: (a) a plastic enclosure surrounding said semiconductor device and having exterior surface; (b) a bar pad attached to said semiconductor device and located in a first plane within said enclosure; (c) at least one lead extending from one end adjacent said bar pad within said enclosure through said exterior surface to another end, said lead including a first and second portions thereof, said first portion extending within said first plane from said exterior surface to said second portion, said second portion having a length of a certain distance including said one end and extending away from said first plane and toward said bar pad, said first portion being spaced, at the end thereof away from said exterior surface, from said bar pad said certain distance.
Claim 13
Dependent Claim
22 words
Package as set forth in Claim 9 wherein said first portion has an enlarged area to secure said lead within said enclosure.
Claim 14
Dependent Claim
28 words
Package as set forth in Claim 9 wherein said lead has a narrow lateral region of reduced mechanical strength located outside said enclosure closely adjacent said exterior surface.
Claim 15
Dependent Claim
22 words
Package as set forth in Claim 11 wherein said lead is bent outside said enclosure along said region from said first plane.
Claim 16
Independent Claim
129 words
A method of packaging a semiconductor device comprising the steps of: (a) forming a substantially flat metallic frame with a centrally disposed bar pad and at least one lead attached at one end to said bar pad and extending away from said bar pad to another opposite end; (b) lancing said lead from said bar pad; (c) displacing said bar pad relative to said lead to a first plane with said lead in a second plane substantially parallel to said first plane; (d) attaching said semiconductor device to said bar pad; (e) forming an electrical connection between a contact pad on said semiconductor device and said lead; and (f) encapsulating said semiconductor-device, said bar pad, and a portion of said lead adjacent said bar pad, including said electrical connection.
Claim 17
Independent Claim
129 words
A method of packaging a semiconductor device comprising the steps of: (a) forming a substantially flat metallic frame with a centrally disposed bar pad and at least one lead attached at one end to said bar pad and extending away from said bar pad to another opposite end; (b) lancing said lead from said bar pad; (c) displacing said bar pad relative to said lead to a first plane with said lead in a second plane substantially parallel to said first plane; (d) attaching said semiconductor device to said bar pad; (e) forming an electrical connection between a contact pad on said semiconductor device and said lead; and (f) encapsulating said semiconductor-device, said bar pad, and a portion of said lead adjacent said bar pad, including said electrical connection.
Claim 18
Dependent Claim
15 words
Method as set forth in Claim 13 wherein steps (b) and (c) are performed simultaneously.
Claim 19
Independent Claim
123 words
The method of packaging a semiconductor device comprising the steps of: (a) forming a lead frame with a bar pad and at least one lead attached at one end to the bar pad and extending to another opposite end within a first plane; (b) lancing said one end from said bar pad, and bending said one end and a portion of said lead adjacent thereto away from said first plane; (c) attaching said semiconductor device to said bar pad; (d) producing an electrical connection between a contact pad on said semiconductor device and said lead adjacent said one end thereof; and (e) encapsulating said semiconductor device, said bar pad, and a portion of said lead adjacent said one end including said electrical connection.
Claim 20
Independent Claim
123 words
The method of packaging a semiconductor device comprising the steps of: (a) forming a lead frame with a bar pad and at least one lead attached at one end to the bar pad and extending to another opposite end within a first plane; (b) lancing said one end from said bar pad, and bending said one end and a portion of said lead adjacent thereto away from said first plane; (c) attaching said semiconductor device to said bar pad; (d) producing an electrical connection between a contact pad on said semiconductor device and said lead adjacent said one end thereof; and (e) encapsulating said semiconductor device, said bar pad, and a portion of said lead adjacent said one end including said electrical connection.
Claim 21
Dependent Claim
15 words
Method as set forth in Claim 15 wherein steps (b) and (c) are formed simultaneously.
Claim 22
Independent Claim
170 words
A method of packaging a semiconductor device comprising the steps of: (a) forming a substantially flat lead frame including a bar pad and at least one lead attached to said bar pad at one end and extending to another opposite end thereof with a lateral region of reduced mechanical strength intermediate said one end and said another end and an area of increased width intermediate said region and said one end; (b) lancing said lead at said one end thereof from said bar pad; (c) displacing said bar pad relative to said lead to a first plane with said lead in a second parallel plane; (d) attaching said semiconductor device to said bar pad; (e) forming an electrical connection between a contact pad on said semiconductor device and said lead adjacent said one end; (f) encapsulating said semiconductor device, said bar pad, and a portion of said lead extending from adjacent said region to said one end; and (g) bending said lead along said region away from said second plane.
Claim 23
Independent Claim
170 words
A method of packaging a semiconductor device comprising the steps of: (a) forming a substantially flat lead frame including a bar pad and at least one lead attached to said bar pad at one end and extending to another opposite end thereof with a lateral region of reduced mechanical strength intermediate said one end and said another end and an area of increased width intermediate said region and said one end; (b) lancing said lead at said one end thereof from said bar pad; (c) displacing said bar pad relative to said lead to a first plane with said lead in a second parallel plane; (d) attaching said semiconductor device to said bar pad; (e) forming an electrical connection between a contact pad on said semiconductor device and said lead adjacent said one end; (f) encapsulating said semiconductor device, said bar pad, and a portion of said lead extending from adjacent said region to said one end; and (g) bending said lead along said region away from said second plane.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.