Patent US5940839A successfully refreshed from Google Patents.
EP0089248A2
Expired / Lapsed
EP
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Dense mounting of semiconductor chip packages
Assignee: Fujitsu Ltd
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Filing: 1983-03-17
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Granted: —
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Expires: 2003-03-17
Abstract
Abstract A semiconductor device comprises a plurality of leadless packages (6) and a base plate (5) for mounting the leadless packages. Each leadless package comprises a semiconductor chip housed therein and a plurality of electrodes (6a) formed on the surface thereof. The base plate comprises conductor patterns formed on both of two main surfaces thereof, and the electrodes of each leadless package are soldered to the conductor patterns. The base plate also comprises a plurality of lead pins (8) which project from one edge thereof in parallel with the main surface. By mounting packages on both sides of the base plate, a high mounting density can be achieved.
Inventors
- 👤 Hidehiko Akasaki
- 👤 Takehisa Tsujimura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 18:36
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; G; G11; G11C; G11C5/00; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H10W90/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09709; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10742; H05K2201/10886; H05K2201/10946; H05K2203/00; H05K2203/15; H05K2203/1572; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3405; H05K3/3447; H05K3/36; H05K3/366; H05K3/40; H05K3/403; H10W70/40; H10W90/20
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
81 words
A semiconductor device comprising: a plurality of leadless packages, each of which comprises a semiconductor chip housed therein and a plurality of electrodes formed on a surface of the package; and a base plate for mounting said leadless packages, said base plate comprising conductor patterns formed on both of two main surfaces thereof, to which patterns said electrodies of each leadless package are soldered, and a plurality of lead pins which project from the said base plate at one edge thereof.
Claim 2
Dependent Claim
81 words
A semiconductor device comprising: a plurality of leadless packages, each of which comprises a semiconductor chip housed therein and a plurality of electrodes formed on a surface of the package; and a base plate for mounting said leadless packages, said base plate comprising conductor patterns formed on both of two main surfaces thereof, to which patterns said electrodies of each leadless package are soldered, and a plurality of lead pins which project from the said base plate at one edge thereof.
Claim 3
Dependent Claim
27 words
A device as claimed in claim 1, wherein said lead pins are soldered to an edge region of one of the main surfaces of said base plate.
Claim 4
Dependent Claim
31 words
A device as claimed in claim 1, wherein such lead pins are soldrered to respective edge regions of both of the two main surfaces of said base plate, in two rows.
Claim 5
Dependent Claim
35 words
A device as claimed in claim 3, wherein each of said lead pins in at least one of the two rows is cranked at a middle portion thereof so as to form a shoulder portion.
Claim 6
Dependent Claim
46 words
A device as set forth in claim 1, wherein each of said lead pins is soldered to the said one edge surface of said base plate at a bent-over connecting portion, the length of which connecting portion is less than the thickness of said base plate.
Claim 7
Dependent Claim
49 words
A device as claimed in claim 5, wherein said lead pins are disposed in two rows, the bending-over direction of each lead pin in one of the rows being opposite to that in the other row, and in that the lead pins of the two rows are alternately disposed.
Claim 8
Independent Claim
17 words
A device as claimed in any preceding claim, wherein said base plate is a multi-layers ceramic plate.
Claim 9
Independent Claim
21 words
A device as claimed in any preceding claim, wherein at least one of the semiconductor chips is a semiconductor memory chip.
Claim 10
Independent Claim
25 words
A device as claimed in any preceding claim, wherein the said lead pins project in a direction substantially parallel to the said two main surfaces.
Claim 11
Dependent Claim
98 words
A semiconductor device comprising a plurality of leadless packages (6), each containing a semiconductor chip, mounted on one main face of a base plate (5) having conductor patterns providing, at the said one main face, conductive portions to which the electrodes of the said leadless packages are respectively soldered, characterised in that the base plate has conductor patterns providing further conductive portions at the opposite main face of the plate, and in that further leadless packages are mounted on the said opposite main face, electrodes of the further packages being soldered respectively to the said further conductive portions.
Claim 12
Dependent Claim
98 words
A semiconductor device comprising a plurality of leadless packages (6), each containing a semiconductor chip, mounted on one main face of a base plate (5) having conductor patterns providing, at the said one main face, conductive portions to which the electrodes of the said leadless packages are respectively soldered, characterised in that the base plate has conductor patterns providing further conductive portions at the opposite main face of the plate, and in that further leadless packages are mounted on the said opposite main face, electrodes of the further packages being soldered respectively to the said further conductive portions.
References Cited (Backward Citations)
No citation records indexed.
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