EP0083406A2
Expired / Lapsed
EP
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Module for supporting electrical components
Assignee: International Business Machines Corp
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Filing: 1982-11-05
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Granted: —
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Expires: 2002-11-05
Abstract
Abstract A chip carrying module includes a number of engineering change lines (ECX, ECY) buried below the surface of the module. The engineering change lines are interrupted periodically to provide a set of vias (48, 84; 49, 53; 54, 58) extending up to the upper surface of the module between each set of chips (10-15) where the vias are connected by dumbbell-shaped pads (45-47, 50-52, 55-57) including a narrow link (46, 51, 56) which permits laser deletion or the like. In addition, the dumbbell-shaped pads are located adjacent to the fan-out pads (41, 75) for the chips. Thus, the fan-out pads can be connected to the dumbbell-shaped pads (45, 70) by means of fly-wires (44, 74). In addition, individual engineering change lines can be connected together to reach every region of the module by connecting a fly-wire (59) from one dumbbell-shaped pad (55) to another (60). In addition, by deleting the links (46, 56, 83, 71) at such dumbbell-shaped pads, the engineering change connections are limited to the particular path required.
Inventors
- 👤 Dudley Augustus Chance
- 👤 Alan Platt
- 👤 Chung Wen Ho
- 👤 Sudipta Kumar Ray
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-24 19:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K1/00; H05K1/02; H05K1/0286; H05K1/0292; H10W70/62; H10W70/641; H10W70/67; H10W70/68; H10W70/685; H05K1/0296; H05K1/0298; H05K2203/00; H05K2203/17; H05K2203/175; H10W70/63
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
155 words
A module for supporting electrical components including a plurality of engineering change conductor lines (ECX, ECY) buried within the module, said engineering change lines extending in at least two directions at corresponding levels within the module crossing over each other without intersecting, characterized in that each of said engineering change lines includes a plurality of sets of interruptions (45-48, 84; 49-53; 54-58) with a set of vias (48, 84;49, 53;54, 58) extending up to the top surface of the module and a plurality of link connections (45-47, 50-52, 55-57) connecting each of said sets of vias on the top surface of the module whereby fly-wires (44, 59) can be connected to the link connections and said link connections (46, 56) can be severed to form an interconnection between any two sets of link connections down to the connected engineering change lines (ECY-1) and up to adjacent link connections for use in making engineering change connections.
Claim 2
Dependent Claim
155 words
A module for supporting electrical components including a plurality of engineering change conductor lines (ECX, ECY) buried within the module, said engineering change lines extending in at least two directions at corresponding levels within the module crossing over each other without intersecting, characterized in that each of said engineering change lines includes a plurality of sets of interruptions (45-48, 84; 49-53; 54-58) with a set of vias (48, 84;49, 53;54, 58) extending up to the top surface of the module and a plurality of link connections (45-47, 50-52, 55-57) connecting each of said sets of vias on the top surface of the module whereby fly-wires (44, 59) can be connected to the link connections and said link connections (46, 56) can be severed to form an interconnection between any two sets of link connections down to the connected engineering change lines (ECY-1) and up to adjacent link connections for use in making engineering change connections.
Claim 3
Dependent Claim
65 words
A module in accordance with claim 1 wherein a plurality of integrated circuits chips (10-15) and fan-out connections (39-41, 91-95) with associated fan-out pads (38, 80, 90) are located on and just beneath said top surface respectively, with a plurality of said link connections (FIG. 2.1-2.6) surrounding said chips whereby the fan-out pads are adapted to be connected to the links with fly-wires (44, 74).
Claim 4
Dependent Claim
37 words
A module in accordance with claim 1 wherein connections are provided between an engineering change line (ECX-1) in the x direction and an engineering change line (ECY-1) in the y direction by means of a fly-wire (59).
Claim 5
Dependent Claim
97 words
A module in accordance with claim 1 wherein connections are provided between a pair of chips (10, 15) on said module by means of engineering change lines and fan-out connections in a network formed by interconnection of an engineering change line (ECX-1) in the x direction with an engineering change line (ECY-1) in the y direction by means of a jumper wire (59) plus interconnection of the ends of the combined x and y engineering change interconnections (45, 75) to fan-out pads (38, 80) for the chips with additional fly-wires (44, 74) connected between the corresponding pads.
Claim 6
Dependent Claim
186 words
A module in accordance with claim 2 wherein a first chip (10) is connected to a second chip (15) by means of interconnections between the fan-out pads (38, 80) where an X directed one (ECX-1) of the engineering change lines is connected to the first of said chips (15) by one of its fan-out pads (80) connected with a fly-wire (74) to a first one of said links (70-72) of said X directed one of the engineering change lines, with the extraneous end of said X directed engineering change line cut by severing of said link to break a bridge (71) formed therein between the vias (69, 73) associated therewith, a Y directed one (ECY-1) of the engineering change lines having its link (45-47) adjacent to said second chip (10) appropriately severed and connected to the appropriate fan-out pad (38) thereof by means of another fly-wire (44), and a pair of appropriately severed links (55-57; 60, 61, 83) of said X directed line and said Y directed line located immediately adjacent each other being connected by a third fly-wire (59), whereby said chips are electrically interconnected.
Claim 7
Dependent Claim
72 words
A module in accordance with claim 1 wherein engineering change lines in the X direction are embedded in a first layer (18X) of the module, engineering change lines in the Y direction are embedded in a second layer (18Y) and standard signal lines (X-l, Y-1) are embedded in at least a third layer (19) and wherein vias (43, 96) are extending from the various lines to the upper surface of the module.
References Cited (Backward Citations)
No citation records indexed.
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