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EP0082783A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Process for manufacturing silicon thin-film transistors on an insulating substrate

Assignee: Cessione france Telecom
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Filing: 1982-12-17
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Granted: —
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Expires: 2002-12-17
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Abstract

Abstract Translated from French Procédé de fabrication de transistors en couches minces en silicium. Method for manufacturing thin film silicon transistors. Selon l'invention, on dépose sur un substrat isolant (10), une couche de métal (12) que l'on photograve, on dépose successivement une couche de silicium (16) sur l'ensemble, une couche de silice (20), une couche de métal de grille (24) et on photograve les trois dernières couches. According to the invention, a layer of metal (12) which is photoetched is deposited on an insulating substrate (10), a layer of silicon (16) is successively deposited on the assembly, a layer of silica (20) , a layer of gate metal (24) and the last three layers are photoetched. Application à la réalisation de composants électroniques de grande surface. Application to the production of large area electronic components.

Inventors

  • 👤 François Morin
  • 👤 Jean-Luc Favennec
  • 👤 Madeleine Bonnel

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-29 16:34
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0314; H10D30/0321; H10D30/60; H10D30/67; H10D30/6704; H10D30/6729; H10D30/673; H10D30/6731; H10D30/6737; H10D30/674; H10D30/6741; H10D30/6743; H10D30/6745; H10D30/6746

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