EP0081419A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
High lead count hermetic mass bond integrated circuit carrier
Assignee: Fairchild Semiconductor Corp
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Filing: 1982-11-30
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Granted: —
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Expires: 2002-11-30
Abstract
Abstract A ceramic carrier for an integrated circuit includes a hermetic electrically insulating substrate 15 having an opening 18, a heat sink 12 attached to the bottom of the integrated circuit 10 and to the back of the substrate 15 to thereby position the integrated circuit 10 in the opening 18, and as many electrically conductive leads 20 as desired attached to the substrate 15 on the opposite side of substrate 15 from heat sink 12. The electrically conductive leads 20 extend across the surface of substrate 15 and into the opening 18 to contact the upper surface of the integrated circuit 10 at desired locations to provide electrical connections to the integrated circuit. The leads 20 may be attached to the integrated circuit 10 by gang bonding using thermocompression.
Inventors
- 👤 Vahak K. Sahakian
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-27 16:11
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W40/00; H10W40/20; H10W40/22; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
128 words
Apparatus for providing electrical connections to an integrated circuit characterized by: an electrically insulating substrate having an opening; supporting means attached to a lower surface of the integrated circuit and to a first surface of the substrate to thereby position the integrated circuit in the opening; , a plurality of electrically conductive leads, each lead comprising a single piece of electrically conductive material disposed on a second surface of the substrate and extending into the opening to contact an upper surface of the integrated circuit to thereby provide electrical connections to the integrated circuit; and cap means covering the opening and attached to the second surface of the substrate to thereby enclose the integrated circuit in a volume defined by the substrate, the opening and the cap means.
Claim 2
Dependent Claim
128 words
Apparatus for providing electrical connections to an integrated circuit characterized by: an electrically insulating substrate having an opening; supporting means attached to a lower surface of the integrated circuit and to a first surface of the substrate to thereby position the integrated circuit in the opening; , a plurality of electrically conductive leads, each lead comprising a single piece of electrically conductive material disposed on a second surface of the substrate and extending into the opening to contact an upper surface of the integrated circuit to thereby provide electrical connections to the integrated circuit; and cap means covering the opening and attached to the second surface of the substrate to thereby enclose the integrated circuit in a volume defined by the substrate, the opening and the cap means.
Claim 3
Dependent Claim
15 words
Apparatus of claim 1 characterized in that the substrate comprises a substantially uniformally thicks layer.
Claim 4
Dependent Claim
19 words
Apparatus of claim 1 or 2 characterized in that the opening is in the shape of the integrated circuit.
Claim 5
Dependent Claim
16 words
Apparatus of claim 1, 2 or 3 characterized in that the substrate comprises a ceramic material.
Claim 6
Dependent Claim
12 words
Apparatus of claim 4 characterized in that the substrate comprises aluminum oxide.
Claim 7
Dependent Claim
17 words
Apparatus of any one of claims 1-5 characterized in that the supporting means comprises a heat sink.
Claim 8
Dependent Claim
22 words
Apparatus of claim 6 characterized in that the heat sink is attached to the integrated circuit with electrically insulating thermally conductive material.
Claim 9
Dependent Claim
16 words
Apparatus of claim 7 characterized in that the electrically insulating thermally conductive material comprises beryllium oxide.
Claim 10
Dependent Claim
22 words
Apparatus of claim 8 characterized in that the beryllium oxide is attached to the integrated circuit with a material comprising indium gold.
Claim 11
Dependent Claim
24 words
Apparatus of claim 8 or 9 characterized in that the beryllium oxide is attached to the heat sink with a material comprising indium gold.
Claim 12
Dependent Claim
15 words
Apparatus of any previous claim characterized in that the first surface includes a ground plane.
Claim 13
Dependent Claim
17 words
Apparatus of any previous claim characterized in that the supporting means is attached to the ground plane.
Claim 14
Dependent Claim
18 words
Apparatus of any previous claim characterized by a cover means disposed on the second surface over the opening.
Claim 15
Dependent Claim
16 words
Apparatus of claim 13 characterized in that the cover means is attached to the second surface.
Claim 16
Dependent Claim
20 words
Apparatus of claim 14 characterized in that the cover means is attached to the second surface with a glass frit.
Claim 17
Dependent Claim
17 words
Apparatus of claim 13, 14 or 15 characterized in that the cover means comprises a ceramic material.
Claim 18
Dependent Claim
13 words
Apparatus of claim 16 characterized in that the ceramic material comprises aluminum oxide.
Claim 19
Dependent Claim
16 words
Apparatus of any previous claim characterized in that the plurality of electrically conductive leads comprise copper.
Claim 20
Dependent Claim
19 words
Apparatus of any previous claim characterized in that the integrated circuit includes bumps to which the leads are attached.
Claim 21
Dependent Claim
16 words
Apparatus of claim 6 characterized in that the supporting means comprises electrically insulating thermally conductive material.
Claim 22
Dependent Claim
13 words
Apparatus of claim 20 characterized in that the supporting means comprises beryllium oxide.
Claim 23
Dependent Claim
26 words
Apparatus of claim 21 characterized in that the beryllium oxide is attached to the lower surface of the integrated circuit with a material comprising indium gold.
Claim 24
Independent Claim
87 words
A method of making electrical connections to an integrated circuit characterized by: attaching the integrated circuit to an underlying structure to thereby form a first assembly; positioning the first assembly in an opening in a second assembly comprising an electrically insulating substrate having the opening and a plurality of electrically conductive leads, each being formed from a single piece of electrically conductive material attached to the substrate and extending into the opening in the substrate; simultaneously connecting each of the plurality of leads to the integrated circuit.
Claim 25
Independent Claim
87 words
A method of making electrical connections to an integrated circuit characterized by: attaching the integrated circuit to an underlying structure to thereby form a first assembly; positioning the first assembly in an opening in a second assembly comprising an electrically insulating substrate having the opening and a plurality of electrically conductive leads, each being formed from a single piece of electrically conductive material attached to the substrate and extending into the opening in the substrate; simultaneously connecting each of the plurality of leads to the integrated circuit.
Claim 26
Dependent Claim
16 words
The method of claim 23 characterized the step of attaching the first assembly to the substrate.
Claim 27
Dependent Claim
16 words
The method of claim 24 characterized by the step of attaching cap means over the opening.
Claim 28
Dependent Claim
28 words
The method of claim 25 characterized in that the steps of attaching the first assembly to the substrate and attaching cap means over the opening are performed simultaneously.
Claim 29
Dependent Claim
29 words
The method of claim 23, 24, 25 or 26 characterized in that the step of simultaneously connecting comprises compressing the leads against the integrated circuit and heating the leads.
Claim 30
Independent Claim
37 words
The method of any one of claims 23-27 characterized in that the step of positioning comprises aligning areas of the integrated circuit to be connected with a portion of the electrically conductive leads extending into the opening.
Claim 31
Independent Claim
18 words
A method of any one of claims 23-28 characterized in that the underlying structure comprises a heat sink.
References Cited (Backward Citations)
No citation records indexed.
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