EP0079424A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Thermal conduction structure for semiconductor packages
Assignee: International Business Machines Corp
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Filing: 1982-07-16
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Granted: —
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Expires: 2002-07-16
Abstract
Abstract An improved conduction cooling system for a semiconductor device (14) includes a slidable piston (28) in contact with said device and slideably mounted in a bore (26) a cap or cold plate (20). A means for urging the piston longitudinally and laterally into contact with said device and the cap or cold plate can consist of a spring-loaded sphere (38). A means (40, 42) to prevent rotation of the piston can be a slot (40) in said bore and a recess (42) in said piston, in both of which said sphere is seated.
Inventors
- 👤 Ralh Ernest Meagher
- 👤 Carl David Ostergren
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 11:08
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
105 words
A cooling structure for a semiconductor package (10) having a substrate (12) on which at least one semiconductor device (14) is mounted, means (18) to join and electrically connect said device to metallurgy on said substrate, a cover (20, 52) on said substrate overlying said device, and at least one piston (28, 58) slidably mounted in an opening (26, 56) in said cover, said piston being urged longitudinally into contact with the back side of said device, characterized in that said piston is urged laterally into contact with at least one wall of said opening, and rotation of said piston in said opening is prevented.
Claim 2
Dependent Claim
105 words
A cooling structure for a semiconductor package (10) having a substrate (12) on which at least one semiconductor device (14) is mounted, means (18) to join and electrically connect said device to metallurgy on said substrate, a cover (20, 52) on said substrate overlying said device, and at least one piston (28, 58) slidably mounted in an opening (26, 56) in said cover, said piston being urged longitudinally into contact with the back side of said device, characterized in that said piston is urged laterally into contact with at least one wall of said opening, and rotation of said piston in said opening is prevented.
Claim 3
Dependent Claim
25 words
The cooling structure of claim 1, wherein means (32, 38, 44;62, 64) are provided urging said piston (28, 58) both longitudinally and laterally into contact.
Claim 4
Dependent Claim
71 words
The cooling structure of claim 1, further including a first layer (34) of low melting metal alloy between the end of said piston (28, 58) and the back side of said semiconductor device (14), said first layer providing a conformal interface between said piston and said device (14) and, preferably, a second layer (36) of a low melting metal alloy between said piston and said wall of said opening (26, 56).
Claim 5
Dependent Claim
43 words
The cooling structure of claim 3, wherein said piston (28, 58) is made of a solder or metal alloy wettable material, e. g. Cu, and said wall of said opening (26, 56) is of a material, e. g. A1, that is not wettable.
Claim 6
Dependent Claim
60 words
The cooling structure of claim 1, wherein said piston (28) is cylindrical, and a means to prevent rotation of said piston is comprised of an inclined top surface (32) on said piston, a recess (42) in said inclined top surface, a longitudinal slot (40) in said opening, and a detent element (38) seated in said recess and said longitudinal slot.
Claim 7
Dependent Claim
37 words
The cooling structure of claims 2 and 5, wherein a means to urge said piston (28) in longitudinal and lateral directions is comprised of a spring (44) urging said detent element (38) in a substantially longitudinal direction.
Claim 8
Dependent Claim
77 words
The cooling structure of claim 7, wherein said recess (42) in said inclined top surface (32) is a groove having an arcuate cross section, said longitudinal slot (40) in said opening is arcuate in cross section, said detent element is a sphere (38), said spring is a helical spring located in said opening (26) said cover above said piston (28) in engagement with said sphere, said spring thereby imparting a laterally directed component force to said piston.
Claim 9
Dependent Claim
39 words
The cooling structure of claim I, wherein a means to prevent rotation is comprised of said piston (58) having a square shaped cross section and said opening (56) in said cover (52) having a corresponding square shaped cross section.
Claim 10
Dependent Claim
55 words
The coolinc structure of claims 2 and 8, wherein a means to urge said piston (58) in longitudinal and lateral directions is comprised of an inclined surface (32) at the top end of said piston, a spring (62, 64) means in contact with said inclined sur-face imparting a force that has longitudinal and lateral components.
Claim 11
Dependent Claim
35 words
The cooling structure of claim 1, wherein sufficient clearance is provided between said piston (28, 58) and said opening (26, 56) to permit tilting of said piston relative to the longitudinal axis of said opening.
References Cited (Backward Citations)
No citation records indexed.
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