EP0078684A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A semiconductor device having a leadless chip carrier
Assignee: Fujitsu Ltd
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Filing: 1982-10-29
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Granted: —
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Expires: 2002-10-29
Abstract
Abstract A semiconductor device comprises a semiconductor chip (10), enclosed in a leadless chip carrier (1) to one side of which the chip is attached, with a cap (8) covering the semiconductor chip. A heat sink plate (21a or 21b) which is electrically connected to the semiconductor chip (8) is provided on the opposite side of the leadless chip carrier (1), thereby improving heat dissipation and facilitating improvements in packing density of such devices.
Inventors
- 👤 Masahiko Mizuo
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 06:14
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W40/00; H10W40/10; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H10W70/67; H10W70/69; H10W70/692; H10W90/00; H10W90/701; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W70/68; H10W70/682; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
115 words
A semiconductor device comprising a semiconductor chip (10), mounted on one main face of a plate-form support member (l),and a cap structure (2,8) secured to the support member (1) so as to encapsulate the chip between the cap structure and the support member, peripheral side surfaces of the device having no electrical connecting pins projecting therefrom but being provided with electrically conductive regions (5), connected respectively to electrical terminals (11) of the semiconductor chip (10), for external connection purposes, characterized in that an electrically conductive plate-form heat sink (21a) is attached to the other main face of the said support member (1) and is electrically connected to another electrical terminal (11) of the said chip.
Claim 2
Dependent Claim
115 words
A semiconductor device comprising a semiconductor chip (10), mounted on one main face of a plate-form support member (l),and a cap structure (2,8) secured to the support member (1) so as to encapsulate the chip between the cap structure and the support member, peripheral side surfaces of the device having no electrical connecting pins projecting therefrom but being provided with electrically conductive regions (5), connected respectively to electrical terminals (11) of the semiconductor chip (10), for external connection purposes, characterized in that an electrically conductive plate-form heat sink (21a) is attached to the other main face of the said support member (1) and is electrically connected to another electrical terminal (11) of the said chip.
Claim 3
Dependent Claim
18 words
A semiconductor device as claimed in claim 1, wherein said semiconductor chip (10) is a semiconductor memory chip.
Claim 4
Dependent Claim
28 words
A semiconductor device as claimed in claim 1 or 2, wherein a major part (8) of the said cap structure is made of metal and/or ceramic and/or resin.
Claim 5
Dependent Claim
25 words
A semiconductor device as claimed in claim 1, 2 or 3, wherein the said plate-form support member (1) is made of ceramic or silicon carbide.:
Claim 6
Dependent Claim
21 words
A semiconductor device as claimed in any preceding claim, wherein said heat sink (21a) is made of cvpper alloy or molybdenum.
Claim 7
Dependent Claim
33 words
A semiconductor device as claimed in any preceding claim, wherein said heat sink (21a) is electrically connected to said semiconductor chip by way of a hole (19a) extending through said support member (1).
Claim 8
Dependent Claim
43 words
7: A semiconductor device as claimed in any preceding claim arranged and connected in electrical circuitry including other such devices, in which circuitry the said heat sinks (21a) of the devices are employed as terminals for the application of respective chip selecting signals.
Claim 9
Dependent Claim
45 words
A semiconductor device as claimed in any preceding claim, wherein a second electrically conductive plate-form heat sink (21b) is attached to the said other main face of the support member (1) and is electrically connected to a further electrical terminal (11) of the said chip.
References Cited (Backward Citations)
No citation records indexed.
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