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EP0077559A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Wafer surface contouring device

Assignee: Hitachi Ltd
•
Filing: 1982-10-18
•
Granted: —
•
Expires: 2002-10-18
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Abstract

Abstract A wafer transforming device defines an airtight space by means of a base (12), a hollow case (16), and a diaphragm type chuck (18) which is fixed to the upper end of the case (16) by suction. In this space (16), a large number of vertically moving elements (24) are arranged at predetermined intervals. In the state in which a wafer is held by suction by means of the chuck (18) and in which the chuck (18) is held in contact with the upper ends of the vertically moving elements (24) by supplying a vacuum pressure into the space, the vertically moving elements (24) located within a required range are selectively actuated. Thus, the chuck (18) is pushed up, and the wafer held on the chuck by the suction is transformed into a desired state.

Inventors

  • 👤 Yukio Kenbo
  • 👤 Nobuyuki Akiyama
  • 👤 Mitsuyoshi Koizumi
  • 👤 Asahiro Kuni

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-25 04:28
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70691; G03F7/707; H; H10; H10P; H10P95/00

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 116 words
In a wafer transforming device wherein a wafer carried by vacuum suction is transformed by pushing it up from a suction surface side thereof; a wafer transforming device characterized by comprising: a base (12), a hollow case (16) which is supported by said base, a diaphragm type chuck (18) which is supported at an upper end of said case (16) and whose upper surface is formed with a groove for suction, a large number of vertically moving elements (24) which are arranged at predetermined intervals in predetermined positions within an airtight space that is defined by said base (12), said case (16) and said chuck (18), and drive means for actuating the vertically moving elements selectively.
Claim 2
Dependent Claim 116 words
In a wafer transforming device wherein a wafer carried by vacuum suction is transformed by pushing it up from a suction surface side thereof; a wafer transforming device characterized by comprising: a base (12), a hollow case (16) which is supported by said base, a diaphragm type chuck (18) which is supported at an upper end of said case (16) and whose upper surface is formed with a groove for suction, a large number of vertically moving elements (24) which are arranged at predetermined intervals in predetermined positions within an airtight space that is defined by said base (12), said case (16) and said chuck (18), and drive means for actuating the vertically moving elements selectively.
Claim 3
Dependent Claim 78 words
A wafer transforming device according to claim 1, wherein said each vertically moving element comprises: a piezoelectric element (29), a case (25) which is attached to said piezoelectric element and whose upper end part is formed to be elastically deformable, and a chip (34) for taking out a displacement value, which is fixed to an upper end of said case (25) and an upper end of which lies in contact with a lower surface of said chuck (18).
Claim 4
Dependent Claim 58 words
A wafer transforming device according to claim 1, comprising an annular stationary base (11) which is arranged outside the first-mentioned base, three vertically moving elements (31) which are arranged on three places of said stationary base (11) and which supports said case (16), and leaf springs (13) which couple said stationary base (11) and said first-mentioned base (12).

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