Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
56 words
A surface mounted high terminal count IC device package comprising an enclosure having a top and bottom and having a plurality of notches in its periphery, on a selected part of one side, a first set of leads formed on the periphery of said one side, and a second set of leads formed in said notches.
Claim 2
Dependent Claim
56 words
A surface mounted high terminal count IC device package comprising an enclosure having a top and bottom and having a plurality of notches in its periphery, on a selected part of one side, a first set of leads formed on the periphery of said one side, and a second set of leads formed in said notches.
Claim 3
Dependent Claim
18 words
A surface mounted high terminal count IC device package according to Claim 1 wherein said enclosure is plastic.
Claim 4
Dependent Claim
36 words
A surface mounted high terminal count IC device package according to Claim 1 wherein said enclosure is four sided and said notches are formed on all four sides of said enclosure and are rectangular in shape.
Claim 5
Dependent Claim
25 words
A surface mounted high terminal count IC device package according to Claim 1 wherein the distance between the first and second leads is approximately 0.025".
Claim 6
Dependent Claim
39 words
A surface mounted high terminal count IC device package according to Claim 1 further including at least one protuberance extending beyond the bottom of said enclosure with said first and second leads bent around said at least one protuberance.
Claim 7
Dependent Claim
47 words
.6. A surface mounted high terminal count IC device package according to Claim 5 wherein a plurality of protuberances are located such as to be aligned with each of said first and second set of leads such that said leads are bent around each of said protuberances.
Claim 8
Dependent Claim
47 words
A surface mounted high terminal count IC device package according to Claim 6 wherein each of said protuberances extends beyond the bottom of said enclosure and the bottom of said enclosure has depressions therein located adjacent said protuberances to accomodate the end of each of said leads.
Claim 9
Dependent Claim
79 words
A carrier for an integrated circuit comprising (a) a plastic enclosure having a top and bottom of approximately equal dimensions, two pairs of parallel lateral sides extending between said top and bottom at right angles thereto, a plurality of notches selectively formed in the periphery of each of the lateral sides, and (b) a first row of metallic leads located on the periphery of said enclosure and a second row of metallic leads located in each of said notches.
Claim 10
Dependent Claim
79 words
A carrier for an integrated circuit comprising (a) a plastic enclosure having a top and bottom of approximately equal dimensions, two pairs of parallel lateral sides extending between said top and bottom at right angles thereto, a plurality of notches selectively formed in the periphery of each of the lateral sides, and (b) a first row of metallic leads located on the periphery of said enclosure and a second row of metallic leads located in each of said notches.
Claim 11
Dependent Claim
44 words
A carrier for an integrated circuit according to Claim 8 wherein each of the metallic leads has one end within said enclosure and extends out of said enclosure through said lateral side, then parallel to said lateral side and back under said bottom side.
Claim 12
Dependent Claim
52 words
A carrier for an integrated circuit according to Claim 9 further including a plurality of rounded protuberances extending beyond the bottom side of said enclosure and a plurality of depressions located adjacent to each protuberance whereby each of said leads bend over the rounded protuberance into the depression to prevent movement thereof.