EP0074816A2
Expired / Lapsed
EP
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High terminal count integrated circuit device package
Assignee: Texas Instruments Inc
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Filing: 1982-09-10
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Granted: —
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Expires: 2002-09-10
Abstract
Abstract An integrated circuit (IC) device package 10 is disclosed suitable for accommodating large terminal count IC devices in a very small space. A first set of terminals 26 is located in notches around the periphery of the package. A second set of terminals 38 is located inboard of the package and are comprised of metallized annular rings on the top and bottom surfaces of the package around holes or apertures through the surfaces of the package with metallization coating the holes to connect the top and bottom annular rings. This second set of terminals may be arranged in rows parallel to the edges of the package 10 and may be connected to the IC device 18 through buried conductor traces 48 and bonding of wires 24. If necessary, additional rows of metallized holes can be utilized in a grid configuration, preferably at 0.050" centers.
Inventors
- 👤 Jon S. Prokop
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 23:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W90/401; H05K2201/00; H05K2201/04; H05K2201/049; H05K2201/09; H05K2201/09145; H05K2201/09181; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K3/36; H05K3/368; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/50; H10W72/531; H10W72/5366; H10W90/701; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
88 words
A high terminal count IC device package comprising a support member having a top and bottom surface, a first set of terminals formed on at least one edge of said support member and having expanded pads on the bottom surface of said support member, and a second set of terminals in proximity to said first set of terminals, each of said second set of terminals comprising a metallized hole through said support member, said metallized hole having an expanded pad on the bottom side of said support member.
Claim 2
Dependent Claim
88 words
A high terminal count IC device package comprising a support member having a top and bottom surface, a first set of terminals formed on at least one edge of said support member and having expanded pads on the bottom surface of said support member, and a second set of terminals in proximity to said first set of terminals, each of said second set of terminals comprising a metallized hole through said support member, said metallized hole having an expanded pad on the bottom side of said support member.
Claim 3
Dependent Claim
30 words
A high terminal count IC device package according to Claim 1 wherein each of said first and second terminals have expanded pads on said top surface of said support member.
Claim 4
Dependent Claim
25 words
A high terminal count IC device package according to Claim 2 wherein said expanded pads for said second set of terminals are annular metallized pads.
Claim 5
Dependent Claim
27 words
A high terminal count IC device package according to Claim 1 wherein selected ones of said expanded pads on the bottom surface of said substrate are raised.
Claim 6
Dependent Claim
21 words
A high terminal count IC device package according to Claim 1 wherein said second terminals are located behind said first terminals.
Claim 7
Dependent Claim
24 words
A high terminal count IC device package according to Claim 1 wherein selected ones of said second terminals are alternated between said first terminals.
Claim 8
Dependent Claim
56 words
A high terminal count IC device package according to Claim 1 further including a third set of terminals in proximity to said second set of terminals, each of said third set of terminals comprising a metallized hole through said support member, said metallized hole having an expanded pad on the bottom surface of said support member.
Claim 9
Dependent Claim
23 words
A high terminal count IC device package according to Claim 7 wherein said second and third set of terminals form a grid pattern.
Claim 10
Dependent Claim
17 words
A high terminal count.IC device package according to Claim 8 wherein said grid pattern is a square.
Claim 11
Dependent Claim
28 words
A high terminal count IC device package according to Claim 9 wherein said second and third set of terminals are on centers equal to or less than 0.100".
Claim 12
Dependent Claim
18 words
A high terminal count IC device package according to Claim 1 wherein said support material is an insulator.
Claim 13
Dependent Claim
17 words
A high terminal count IC device package according to Claim 11 wherein said insulator is a ceramic.
Claim 14
Dependent Claim
42 words
A high terminal count IC device package according to Claim 1 wherein said first set of terminals comprise a metallized notch in the edge of the support member and connected to the expanded pad on the bottom surface of the support member.
Claim 15
Dependent Claim
119 words
A surface mounted high terminal count IC device package for attachment to a substrate comprising a support member having a top and bottom surface, a plurality of wire bonding terminals in a predetermined pattern on said support member for connection to an integrated circuit chip, peripheral terminals formed on the edge of said support member, metallized hole terminals in said support member, trace conductors supported by said support member interconnecting said IC terminals with said peripheral and metallized hole terminals, whereby when said IC device package is attached by the peripheral and metallized hole terminals to said substrate with solder, solder fillets on the peripheral terminals and solder wicking in each metallized hole terminal indicate a good solder connection.
Claim 16
Dependent Claim
119 words
A surface mounted high terminal count IC device package for attachment to a substrate comprising a support member having a top and bottom surface, a plurality of wire bonding terminals in a predetermined pattern on said support member for connection to an integrated circuit chip, peripheral terminals formed on the edge of said support member, metallized hole terminals in said support member, trace conductors supported by said support member interconnecting said IC terminals with said peripheral and metallized hole terminals, whereby when said IC device package is attached by the peripheral and metallized hole terminals to said substrate with solder, solder fillets on the peripheral terminals and solder wicking in each metallized hole terminal indicate a good solder connection.
Claim 17
Dependent Claim
32 words
A surface mounted high terminal count IC device package according to Claim 14 wherein both said peripheral and metallized hole terminals have expanded pads on the bottom surface of said support member.
Claim 18
Dependent Claim
32 words
A surface mounted high terminal count IC device package according to Claim 15 wherein both said peripheral and metallized hole terminals have expanded pads on the top surface of said support member.
Claim 19
Dependent Claim
23 words
A surface mounted IC device package according to Claim 16 wherein the expanded pads for the metallized hole terminals are annular metallized pads.
Claim 20
Dependent Claim
35 words
A surface mounted IC device package according to Claim 14 wherein said trace conductors are positioned at different levels within the support member to interconnect the IC terminals with the peripheral and metallized hole terminals.
Claim 21
Dependent Claim
29 words
A surface mounted high terminal count IC device package according to Claim 15 wherein selected ones of said expanded pads on the bottom surface of said substrate are raised.
Claim 22
Dependent Claim
24 words
A surface mounted high terminal count IC device package according to Claim 14 wherein said metallized hole terminals are located behind said peripheral terminals.
Claim 23
Dependent Claim
27 words
A surface mounted high terminal count IC device package according to Claim 14 wherein selected ones of said metallized hole terminals are alternated between said peripheral terminals-.
Claim 24
Dependent Claim
59 words
A surface mounted high terminal count IC device package according to Claim 14 further including a second set of metallized hole terminals in proximity to the first metallized hole terminals, each of said second set of metallized-hole terminals comprising a metallized hole through said support member and having an expanded pad on the bottom surface of said support member.
Claim 25
Dependent Claim
25 words
A surface mounted high terminal count IC device package according to Claim 22 wherein the two sets of metallized hole terminals form a grid pattern.
Claim 26
Dependent Claim
20 words
A surface mounted high terminal count IC device package according to Claim 23 wherein said grid pattern is a square.
Claim 27
Dependent Claim
30 words
A surface mounted high terminal count IC device package according to Claim 24 wherein the first and second metallized hole terminals are on centers equal to or less than 0.100".
Claim 28
Dependent Claim
20 words
A surface mounted high terminal count IC device package according to Claim 14 wherein said support material is an insulator.
Claim 29
Dependent Claim
19 words
A surface mounted high terminal count IC device package according to Claim 26 wherein said insulator is a ceramic.
Claim 30
Dependent Claim
42 words
A surface mounted high terminal count IC device package according to Claim 15 wherein said peripheral terminals comprise a metallized notch in the edge of the support member and connected to the expanded pad on the bottom surface of the support member.
Claim 31
Dependent Claim
52 words
A high terminal count IC device package comprising a support member having a top and bottom surface, a first set of terminals positioned on the periphery of said support members, and a second set of metallized hole terminals positioned on said support member and located inboard from said first set of terminals.
Claim 32
Dependent Claim
52 words
A high terminal count IC device package comprising a support member having a top and bottom surface, a first set of terminals positioned on the periphery of said support members, and a second set of metallized hole terminals positioned on said support member and located inboard from said first set of terminals.
References Cited (Backward Citations)
No citation records indexed.
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