EP0069505A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor device connection lead formation
Assignee: Fujitsu Ltd
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Filing: 1982-06-22
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Granted: —
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Expires: 2002-06-22
Abstract
Abstract Connection leads (32, 35) of a semiconductor device extending from a chip carrier housing (31) for connection with external circuitry are arranged in a plurality of rings, one within the other. The leads (32), in the outermost ring, are composed of surface connection leads to be electrically connected to the uppermost layer (41) only of a multilayer printed circuit board (40) and the connecting leads in the inner ring or rings are composed of lead pins (35) to be inserted into and be electrically connected to plated through holes (35) of the multilayer printed circuit board (40) for connection to other layers (43) of the board (40).
Inventors
- 👤 Yasunori Kanai
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 08:41
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3415; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W70/685; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W76/157; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10689; H05K2201/10704; H05K3/3421; H05K3/3447; H10W70/682; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
178 words
A semiconductor device for mounting on a multilayer printed circuit board having plated through holes and a printed circuit on its upper surface, the device comprising: at least one semiconductor chip (30); a chip carrier housing (34, 54, 64, 74, 84, 94, 111) for packaging the semiconductor chip (30, 110); and, a plurality of connection leads (32, 35, 52, 55, 62, 72, 82, 95, 92, 95, 112, 115) electrically connected to the semiconductor chip and projecting outwards from the surface of the chip carrier housing, the connection leads being arranged in a plurality of rings, one within the other, the connection leads (32, 52, 62, 72, 82, 92, 112) in the outer ring being composed of surface connection leads arranged to be connected only to the printed circuit on the upper surface of the multilayer printed board, and the connection leads (35, 55, 85, 95, 115) in the inner ring or rings being composed of lead pins arranged to be inserted into and to be electrically connected to the plated through holes of the multilayer printed circuit board.
Claim 2
Dependent Claim
178 words
A semiconductor device for mounting on a multilayer printed circuit board having plated through holes and a printed circuit on its upper surface, the device comprising: at least one semiconductor chip (30); a chip carrier housing (34, 54, 64, 74, 84, 94, 111) for packaging the semiconductor chip (30, 110); and, a plurality of connection leads (32, 35, 52, 55, 62, 72, 82, 95, 92, 95, 112, 115) electrically connected to the semiconductor chip and projecting outwards from the surface of the chip carrier housing, the connection leads being arranged in a plurality of rings, one within the other, the connection leads (32, 52, 62, 72, 82, 92, 112) in the outer ring being composed of surface connection leads arranged to be connected only to the printed circuit on the upper surface of the multilayer printed board, and the connection leads (35, 55, 85, 95, 115) in the inner ring or rings being composed of lead pins arranged to be inserted into and to be electrically connected to the plated through holes of the multilayer printed circuit board.
Claim 3
Dependent Claim
31 words
A semiconductor device according to claim 1, wherein the connection leads (32, 52, 62) arranged in the outermost ring emerge from the side of the chip carrier housing (33, 53, 63).
Claim 4
Dependent Claim
71 words
A semiconductor device according to claim 2, wherein each of the connection leads (32) in the outermost ring comprises: a first potion (32a) which extends downwards from the side of the chip carrier housing (33), the first portion being close to the'side of the housing (33); and, a second portion (32b) which extends outwards from the end of the first portion (32a) in a direction perpendicular to the lead pins (35).
Claim 5
Dependent Claim
95 words
A semiconductor device according to claim 2, wherein each of the connection leads (32) in the outermost ring comprises: a first portion (52a) which projects and extends outwards from the side (53) of the chip carrier housing (51); a second portion (52b) which extends downwards from the end of the first portion (52a) along the side of the chip carrier housing (53), the second portion being spaced from the side (53); and, a third portion (52c) which extends outwards from the end of the second portion in a direction perpendicular to the lead pins (55).
Claim 6
Dependent Claim
45 words
A semiconductor device according to claim 2, wherein each of the connection leads (62) in the outermost ring is composed of a member which extends downwards from the side of the chip carrier housing (61), the member being adjacent the side (63) of the housing.
Claim 7
Dependent Claim
30 words
A semiconductor device according to claim 1, wherein the connection leads (72, 82, 92) in the outermost ring emerge from the bottom of the chip carrier housing (74, 84, 94).
Claim 8
Dependent Claim
39 words
A semiconductor device according to claim 6, wherein each of the connection leads (72) arranged in the outermost ring is composed of a member which extends parallel with the bottom of the chip carrier housing (74) and projects outwards.
Claim 9
Dependent Claim
75 words
A semiconductor device according to claim 6, wherein each of the connection leads (82) arranged in the outermost ring comprises: a first portion (82a) which extends outwards along the bottom of the chip carrier housing (84); a second portion (82b) which extends downwards from the end of the first portion (82a); and, a third portion (82c) which extends outwards from the end of the second portion in a direction perpendicular to the lead pins (85).
Claim 10
Dependent Claim
39 words
A semiconductor device according to claim 6, wherein each of the connection leads in the outermost ring is composed of a lead pin (92) which is shorter than the lead pins (95) arranged in the inner ring or rings.
Claim 11
Dependent Claim
125 words
A semiconductor device in accordance with any one of the preceding claims in combination with a multilayer printed circuit board (40, 100), the printed circuit board (40, 100) having plated through holes (42, 103) and a printed circuit (41, 101) on its upper surface, the outer ring of connection leads (32, 52, 62, 72, 82, 92, 115) being electrically connected only to the printed circuit (41, 101) on the upper surface of the multilayer printed circuit board (40, 100) and the lead pins (35, 55, 85, 95, 115) forming the connecting leads in the inner ring or rings being electrically connected to the plated through holes (42, 103) to connect with layers (43) of the printed circuit board (40, 100) not on its upper surface.
References Cited (Backward Citations)
No citation records indexed.
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