Patent US4026658A successfully refreshed from Google Patents.
EP0058068A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Integrated circuit chip carrier
Assignee: British Telecommunications PLC
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Filing: 1982-02-08
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Granted: —
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Expires: 2002-02-08
Abstract
Abstract Known chip carriers are usually made of ceramic material which is expensive and can give rise to problems due to differential expansion when bonded to conventional epoxy/glass printed circuit board. The invention provides a chip carrier comprising a base (10) of plastics material and a side wall (22) of plastics material, extending around the periphery of the chip carrier so as to define a chip mounting cavity. Conductive tracks extend from first connecting points (12) in the cavity to second connecting points (18) on the periphery of the chip carrier.
Inventors
- 👤 Francis Nihal Sinnadurai
- 👤 James Anthony Cook
- 👤 William Keith Gurnett
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 19:22
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H10W70/62; H10W70/65; H10W70/657; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
80 words
A chip carrier comprising a base of plastics material, a side wall of plastics material connected to the top surface of the base and extending around the periphery of the chip carrier so as to define a chip mounting cavity on said base, a metallization pattern formed on said base and comprising a plurality of tracks of conductive material extending from first connecting points in said chip mounting cavity to second connecting points on the periphery of said chip carrier.
Claim 2
Dependent Claim
80 words
A chip carrier comprising a base of plastics material, a side wall of plastics material connected to the top surface of the base and extending around the periphery of the chip carrier so as to define a chip mounting cavity on said base, a metallization pattern formed on said base and comprising a plurality of tracks of conductive material extending from first connecting points in said chip mounting cavity to second connecting points on the periphery of said chip carrier.
Claim 3
Dependent Claim
38 words
A chip carrier as claimed in claim 1 wherein said base forms part of a printed circuit board and wherein said second connecting points are connected directly to tracks of conductive material formed on said printed circuit board.
Claim 4
Dependent Claim
38 words
A chip carrier as claimed in claim 1 wherein said second connecting points are formed on the . underside of said base and wherein said tracks of . conductive material extend through plated-through holes formed in said base.
Claim 5
Dependent Claim
60 words
A method of making a chip carrier as claimed in claim 1, comprising the steps of orming an ; array of metallization patterns on a base sheet of plastics material, and securing a lattice of plastics material to said base sheet overlying said metallization array and so as to define a plurality of chip mounting cavities on said base sheet.
Claim 6
Dependent Claim
35 words
A method as claimed in claim 4 wherein said base sheet and lattice are sectioned into a plurality of individual chip carriers by way of cutting apparatus which cuts along the lines of said lattice.
References Cited (Backward Citations)
No citation records indexed.
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