EP0055323A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Apparatus for soldering chip type components
Assignee: Panasonic Holdings Corp
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Filing: 1981-08-29
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Granted: —
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Expires: 2001-08-29
Abstract
Abstract An improved process of soldering printed circuit boards which includes the steps of forming a first solder wave from a first nozzle at least in the direction of movement of the printed circuit board, and forming, from a second nozzle, a second solder wave higher in height than the first solder wave and flowing out from the second nozzle at least in the direction counter to the direction of movement of the printed circuit board which is inclined for contact, at its under surface, with the first and second solder waves, and an apparatus for efficiently carrying out the above process even when small chip type components are mounted at high density on the printed circuit board.
Inventors
- 👤 Takao Inoue
- 👤 Keiji Saeki
- 👤 Chuichi Matsuda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-27 13:01
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/08; B23K3/00; B23K3/06; B23K3/0646; B23K3/0653; B23K2101/00; B23K2101/36; B23K2101/42; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/3465; H05K3/3468
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
143 words
In a process of soldering printed circuit boards including the steps of supplying molten solder into independent first and second nozzles so as to flow out therefrom, and effecting soldering by passing a printed circuit board in the order of said first nozzle and said second nozzle, the improvement comprising.the steps of forming a first solder wave from said first nozzle at least in the direction of movement of said printed circuit board, and forming, at said second'nozzle, a second solder wave higher in height than said first solder wave and flowing out from said second nozzle at least in a direction counter to the direction of movement of said printed circuit board, said printed circuit board being moved in an inclined state so that the surface thereof contacts said first and second solder waves flowing out from said first and second nozzles.
Claim 2
Dependent Claim
143 words
In a process of soldering printed circuit boards including the steps of supplying molten solder into independent first and second nozzles so as to flow out therefrom, and effecting soldering by passing a printed circuit board in the order of said first nozzle and said second nozzle, the improvement comprising.the steps of forming a first solder wave from said first nozzle at least in the direction of movement of said printed circuit board, and forming, at said second'nozzle, a second solder wave higher in height than said first solder wave and flowing out from said second nozzle at least in a direction counter to the direction of movement of said printed circuit board, said printed circuit board being moved in an inclined state so that the surface thereof contacts said first and second solder waves flowing out from said first and second nozzles.
Claim 3
Independent Claim
183 words
An apparatus for soldering printed circuit boards which comprises independent first and second nozzles for spouting molten solder upwardly therefrom so as to respectively form first and second solder waves, and transport means which holds the printed circuit board for transporting said printed circuit board so as to bring an under surface of the printed circuit board into successive contact with said first and second solder waves spouting from said first and second nozzles, said second solder wave from the second nozzle located at a downstream side being arranged to be higher, in the height of crest thereof, than said first solder wave from said first nozzle located at an upstream side with respect to the direction of transportation of said printed circuit board, said first and second nozzles being adapted to form said first and second solder waves:flowing at least in the direction opposite to each other, said transport means being arranged to transport said printed circuit board in a state inclined at an angle corresponding to the heights of said first and second* solder waves of said first and second nozzles.
Claim 4
Independent Claim
183 words
An apparatus for soldering printed circuit boards which comprises independent first and second nozzles for spouting molten solder upwardly therefrom so as to respectively form first and second solder waves, and transport means which holds the printed circuit board for transporting said printed circuit board so as to bring an under surface of the printed circuit board into successive contact with said first and second solder waves spouting from said first and second nozzles, said second solder wave from the second nozzle located at a downstream side being arranged to be higher, in the height of crest thereof, than said first solder wave from said first nozzle located at an upstream side with respect to the direction of transportation of said printed circuit board, said first and second nozzles being adapted to form said first and second solder waves:flowing at least in the direction opposite to each other, said transport means being arranged to transport said printed circuit board in a state inclined at an angle corresponding to the heights of said first and second* solder waves of said first and second nozzles.
Claim 5
Dependent Claim
49 words
An apparatus as claimed in Claim 2, wherein said second nozzle is provided with a dam member at a front upper edge thereof so as to direct the molten solder forming said second solder wave in a direction counter to the direction of movement of the printed circuit board.
Claim 6
Dependent Claim
56 words
An apparatus as claimed in Claim 2, wherein a distance between a front upper edge of said first nozzle and a rear upper edge of said second nozzle is set to be in the range more than 3 cm to less than 20 cm, and more preferably, more than 5 cm to less than 15 cm.
Claim 7
Dependent Claim
67 words
An apparatus as claimed in Claim 2, wherein a front upper edge of the first nozzle and a rear upper edge of said second nozzle are each provided with first and second control plates extending towards each other therefrom, with a distance between corresponding edges of. said first and second control plates being set to be larger than 1 cm, and more preferably, larger then 2 cm.
Claim 8
Dependent Claim
86 words
An apparatus as claimed in Claim 5, wherein dimensions of said first and second·nozzles are in such relations as, and more preferably, as with ℓ, S1, S2 and d being in the relation ℓ=S1+S2i+a, where ℓ is a distance between a front upper edge of said first nozzle and a rear upper edge of said second nozzle, S1 and S2 are each lengths of said first and second control plates, and d is the distance between the corresponding edges of said first and second control plates.
Claim 9
Dependent Claim
41 words
An apparatus as claimed in Claim 2, wherein a tangential angle at a rear edge in the vicinity of a spouting port of said first nozzle is in the range from 2 to 80°, and more preferably, from 5 to 60°.
Claim 10
Dependent Claim
52 words
An apparatus as claimed in Claim 2, wherein said first and second nozzles are respectively provided in corresponding solder sump portions formed by dividing one molten solder container by a partition wall for forming said first and second solder waves of different heights by corresponding two impeller members driven by two motors
Claim 11
Dependent Claim
33 words
An apparatus as claimed in Claim 2, wherein said first and second nozzles are respectively provided in two separate molten solder containers which are placed side by side for association with each other.
Claim 12
Dependent Claim
57 words
An apparatus as claimed in Claim 2, wherein said first and second nozzles are provided in one molten solder container without a partition wall for forming said first and second solder waves of different heights by one impeller member driven by one motor through alterations of sizes of solder spouting ports of said first and second nozzles.
Claim 13
Dependent Claim
46 words
An apparatus as claimed in Claim 10, wherein the size of the solder spouting port of said second nozzle is made smaller than that of the first nozzle so as to render the height of said second solder wave higher than that the first solder wave.
Claim 14
Dependent Claim
106 words
An apparatus as claimed in Claim 10, wherein said first nozzle and second nozzle are so arranged, in the relation, between molten solder flow-in port areas thereof, that respective area ratios are represented by a formula, where Al is a solder flow-in port area for the first nozzle, A2 is a solder flow-in area for the second nozzle with respect to the direction of movement of the printed circuit board, Vl and V2 are respective nozzle inner face volumes of said first and second nozzles from molten solder level to the respective solder flow-ports, and K is a factor in the range of 0.1 to 1.2.
References Cited (Backward Citations)
No citation records indexed.
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