EP0047184A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors
Assignee: EIDP Inc
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Filing: 1981-09-02
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Granted: —
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Expires: 2001-09-02
Abstract
Abstract A polyamide ester resin containing photopolymerizable groups is made more rapidly photopolymerizable and therefore more suitable for forming relief structures on electrical devices (such as capacitors, integrated circuits and semiconductors) by including therein a radiation-sensitive polymerizable polyfunctional acrylate compound and an aromatic biimidazole photopolymerization initiator. On exposure through a pattern of a dried film obtained using a solution of such composition, photopolymerization takes place rapidly and efficiently following which developing can be effected and the photopolymerized material baked to leave a heat- resistant polyimide structure.
Inventors
- 👤 David Lee Goff
- 👤 Edward Lung Yuan
- 👤 Stephen Proskow
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 13:18
CPC Classifications
G; G03; G03C; G03C5/00; C; C08; C08F; C08F290/00; C08F290/08; C08F290/14; C08F290/145; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; G03F7/037
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
29 words
A radiation polymerizable composition comprising a polyamide ester resin containing photopolymerizable groups, a solvent for the resin, a radiation-sensitive polymerizable polyfunctional acrylate compound and an aromatic bisimidazole photopolymerization initiator.
Claim 2
Dependent Claim
29 words
A radiation polymerizable composition comprising a polyamide ester resin containing photopolymerizable groups, a solvent for the resin, a radiation-sensitive polymerizable polyfunctional acrylate compound and an aromatic bisimidazole photopolymerization initiator.
Claim 3
Dependent Claim
48 words
A composition as claimed in.Claim 1 wherein the polymerizable polyfunctional acrylate compound is present in an amount of 5-30% by weight, based on the weight of the resin, and the photopolymerization initiator is present in an amount of 0.5-15% by weight, based on the weight of the resin.
Claim 4
Dependent Claim
75 words
A composition as claimed in Claim 1 or Claim 2 wherein the polyamide ester resin has the following structure:- wherein → denotes isomerism, R is an aromatic radical, R 1 is an organic radical containing a photopolymerizable olefinic bond, R 2 is an aromatic, aliphatic or cycloaliphatic radical and n is an integer sufficiently large to provide the resin with a weight average molecular weight of about 5,000 to 75,000 determined by gel permeation chromatography.
Claim 5
Dependent Claim
48 words
A composition as claimed in Claim 3 wherein the polyamide ester resin has the structural formula (I) in which R is the residue of pyromellitic dianhydride, R 1 is the residue of hydroxyalkyl methacrylate or hydroxyalkyl acrylate and -NH-R 2 -NH- is the residue of an aromatic diamine.
Claim 6
Dependent Claim
62 words
A composition as claimed in any preceding claim wherein the polymerizable polyfunctional acrylate is trimethylol propane trimethacrylate, trimethylol propane triacrylate, trimethylol propane ethoxylate trimethacrylate, trimethylol propane ethoxylate triacrylate, trimethylol propane polyethoxylate trimethacrylate, trimethylol propane polyethoxylate triacrylate, pentaerythritol triacrylate, polyethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol dimethacrylate, polymethylene diacrylate, polymethylene dimethacrylate, trimethylene glycol dimethacrylate or a mixture of two or more thereof.
Claim 7
Dependent Claim
16 words
A composition as claimed in any preceding claim wherein the photopolymerization initiator is bis(2-o-chlorophenyl-4,5-diphenylimidazolyl) or bis[2-o-chloro-phenyl-4,5-di(methoxyphenyl)imidazolyl].
Claim 8
Dependent Claim
24 words
A composition as claimed in any preceding claim and including 0.1-10% by weighty based on the weight of the resin, of a leuco dye.
Claim 9
Dependent Claim
17 words
A composition as claimed in Claim 7 in which the leuco dye is an alkyl amino-aromatic alkane.
Claim 10
Dependent Claim
28 words
A composition as claimed in any preceding claim and including 0.1-10% by weight, based on the weight of the resin, of a photosensitizer (in addition to the initiator).
Claim 11
Dependent Claim
85 words
A composition as claimed in any preceding claim wherein the polyamide ester resin is the product of esterifying pyromellitic dianhydride with hydroxyethyl methacrylate and reacting the resulting ester with oxydianiline; the polyfunctional acrylate compound is trimethylol propane polyethoxylate having a weight average molecular weight of about 500-1500; the photopolymerization initiator is bis(2-o-chlorophenyl-4,5-diphenylimidazolyl); and the composition contains about 0.1-10% by weight, based on the weight of the resin, of tris(diethylamino-o-tolyl) methane, and about 0.1-10% by weight,based on the weight of the resin, of tetramethyldiamino benzophenone photosensitizer.
Claim 12
Dependent Claim
84 words
A composition as claimed in any one of claims 1 to 9 wherein the polyamide ester is the product of esterifying pyromellitic dianhydride with hydroxyethyl methacrylate and reacting the resulting ester with oxydianiline; the polyfunctional acrylate is trimethylol propane trimethacrylate or trimethylol propane triacrylate; the polymerization initiator is bis(2-o-chlorophenyl-4,5-diphenylimidazolyl); and the composition contains about 0.1-10% by weight, based on the weight of the resin, of tris(diethyl amino-o-tolyl) methane and about 0.1-10% by weight, based on the weight of the resin, of tetramethyldiamino benzophenone photosensitizer.
Claim 13
Dependent Claim
18 words
An electrical device coated with a polymerized polyimide structure layer resulting from the composition of any preceding claim.
Claim 14
Dependent Claim
17 words
The electrical device of Claim 12 which is a capacitor, semiconductor, multilayer circuit or an integrated circuit.
Claim 15
Dependent Claim
23 words
A radiation polymerizable composition comprising a polyamide ester resin containing photopolymerizable groups, a solvent for the resin and an aromatic bisimidazole photopolymerization initiator.
Claim 16
Dependent Claim
23 words
A radiation polymerizable composition comprising a polyamide ester resin containing photopolymerizable groups, a solvent for the resin and an aromatic bisimidazole photopolymerization initiator.
Claim 17
Dependent Claim
21 words
A composition as claimed in Claim 14 wherein the resin has the structural formula defined in Claim 3 or Claim 4.
Claim 18
Dependent Claim
48 words
A composition as claimed in Claim 15 wherein the polyamide ester resin is the product of esterifying pyromellitic dianhydride with hydroxyethyl methacrylate and reacting the resulting ester with oxydianiline; the photopolymerization initiator is bis[2-o-chlorophenyl-4,5-di(methoxyphenyl)imidazolyl] ; and the composition contains about 0.1-10% by weight of a tetramethyldiamino benzophenone photosensitizer.
Claim 19
Dependent Claim
24 words
A radiation-polymerizable composition comprising a polyamide ester resin containing photopolymerizable groups, a solvent for the resin, a photoinitiator and a polymerizable polyfunctional acrylate compound.
Claim 20
Dependent Claim
24 words
A radiation-polymerizable composition comprising a polyamide ester resin containing photopolymerizable groups, a solvent for the resin, a photoinitiator and a polymerizable polyfunctional acrylate compound.
Claim 21
Dependent Claim
31 words
A composition as claimed in Claim 17 wherein the polyfunctional acrylate compound is present in an amount of from 5% to 30% by weight based on the weight of the resin.
Claim 22
Independent Claim
77 words
A method for the formation of a relief structure on an electrical device which method comprises applying to the substrate of the device a solution of a radiation-sensitive polyamide ester resin composition containing (i) said resin, (ii) a radiation-sensitive polymerizable polyfunctional acrylate compound, and (iii) an aromatic bisimidazole photopolymerization initiator; drying the composition; exposing the composition to radiation through a pattern; dissolving unradiated portions; and baking the resulting relief structure to form a heat- resistant polyimide structure.
Claim 23
Independent Claim
77 words
A method for the formation of a relief structure on an electrical device which method comprises applying to the substrate of the device a solution of a radiation-sensitive polyamide ester resin composition containing (i) said resin, (ii) a radiation-sensitive polymerizable polyfunctional acrylate compound, and (iii) an aromatic bisimidazole photopolymerization initiator; drying the composition; exposing the composition to radiation through a pattern; dissolving unradiated portions; and baking the resulting relief structure to form a heat- resistant polyimide structure.
References Cited (Backward Citations)
No citation records indexed.
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