EP0044136A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Encapsulation of electronic device
Assignee: AGC Inc
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Filing: 1981-06-11
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Granted: —
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Expires: 2001-06-11
Abstract
Abstract An encapsulation (2) of an electronic device (1) is carried out by using a synthetic thermoplastic resin compound having low viscosity in a molding condition which comprises polyphenylene sulfide and a filler at a ratio of 1 : to 4:1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt. parts per 100 wt. parts of polyphenylene sulfide by a transfer molding process or an injection molding process.
Inventors
- 👤 Hiroshi Yanase
- 👤 Fukuo Kanno
- 👤 Takeshi Abe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 21:40
CPC Classifications
H; H01; H01G; H01G2/00; H01G2/12; C; C08; C08L; C08L81/00; C08L81/02; H05; H05K; H05K5/00; H05K5/06; H05K5/065; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; C08L101/00; C08L61/00; C08L61/04; C08L63/00; C08L71/00; C08L83/00; C08L83/04
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
87 words
1) In an encapsulation of an electronic device with a synthetic resin compound, an improvement characterized in that said synthetic resin compound is a thermoplastic compound having low viscosity in a molding process which comprises polyphenylene sulfide and a filler at a ratio of 1 : 4 to 4 : 1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt.parts per 100 wt.parts of polyphenylene sulfide and said encapsulation is carried out by a transfer molding process or an injection molding process.
Claim 2
Dependent Claim
87 words
1) In an encapsulation of an electronic device with a synthetic resin compound, an improvement characterized in that said synthetic resin compound is a thermoplastic compound having low viscosity in a molding process which comprises polyphenylene sulfide and a filler at a ratio of 1 : 4 to 4 : 1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt.parts per 100 wt.parts of polyphenylene sulfide and said encapsulation is carried out by a transfer molding process or an injection molding process.
Claim 3
Dependent Claim
44 words
2) The encapsulation according to Claim 1 wherein said tacky or adhesive polymer has a melting point or softening point of 200°C or lower and a 5% weight loss temperature of at least 300°C measured at a temperature rising rate of 10°C/min. in air.
Claim 4
Dependent Claim
32 words
3) The encapsulation according to Claim 1 or 2 wherein said tacky or adhesive polymer is at least one selected from the group consisting of phenoxy resins, epoxy resins and silicone resins.
Claim 5
Dependent Claim
53 words
4) The encapsulation according to Claim 1 wherein said thermoplastic compound has an apparent viscosity of 1 x 10 2 to 8 x 10 3 poise measured by using a dice having a diameter of 0.5 mm and a land length of 1.0 mm under an extrusion pressure of 30 kg/cm at 300°C.
Claim 6
Dependent Claim
49 words
5) The encapsulation according to Claim 1 wherein said molding process is a transfer molding process or an injection molding process under conditions of a molding pressure of 5 to 100 kg/cm 2 , a barrel temperature of 280 to 360°C and a die temperature of 80 to 250°C.
Claim 7
Dependent Claim
21 words
6) The encapsulation according to Claim 1 wherein at least part of said filler is a silica powder having high purity.
References Cited (Backward Citations)
DE2500789A1
Cited
US3998767A
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JPS52149348A
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GB1526159A
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JPS5322363A
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JPS5366656A
Cited
JPS54155300A
Cited
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