Multilayer ceramic capacitor device

Claim 1

- A ceramic capacitor device comprising a ceramic chip (10) containing embedded electrodes (20) having opposed rectangular shaped end surfaces (30, 40) at which surfaces ends of alternate embedded electrodes are exposed and opposed rectangular shaped side surfaces (70, 80) parallel to said embedded electrodes and sustantially larger in area than said opposed end surfaces (30, 40), each opposed end surface (30; 40) and contiguous portions (33, 43) of said opposed side surfaces (70, 80) being metallized to provide an electrical contact with exposed ends of embedded electrodes, a pair of metal foil terminal leads (100, 110) each having a strip portion (101, 102) of substantially the same width as the distance between the opposed end surfaces (30, 40) of the ceramic chip, said strip portions being opposite and parallel to each other and parallel to the side surfaces (70, 80) of said ceramic chip, characterized in that each said strip portion (101, 102) has (i) a first extension (103, 104) overlying one metallized portion (33, 43) of the side surface (70, 80) closest to said strip portion and also overlying most of the unmetallized portion (70, 80) of the same side surface and (ii) a second extension (105, 115) of substantially L-shaped cross section overlying the metallized end surface (30, 40) adjacent the aforesaid metallized side surface portion and the metallized portion (33, 43) of the opposed side surface contiguous to said metallized end surface, the said metallized portions being metallurgically bonded to said overlying metal foil extensions.