EP0042987B1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic circuit chip carrier
Assignee: International Business Machines Corp
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Filing: 1981-06-03
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Granted: 1989-03-08
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Expires: 2001-06-03
Abstract
No abstract record available.
Inventors
- 👤 Christopher Henry Bajorek
- 👤 Dudley Augustus Chance
- 👤 Chung Wen Ho
- 👤 David Allen Thompson
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 10:53
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H10; H10W; H10W44/00; H10W44/601; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K1/18; H05K1/182; H05K1/185; H05K2201/00; H05K2201/10; H05K2201/10007; H05K2201/10015; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H10W70/6875; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
172 words
Electronic chip carrier (9) including a planar substrate (10) having a first and a second surface opposite to each other and a plurality of electrical conductor means within the substrate to provide electrical interconnection between said opposed surfaces of the substrate (10) from one (6) of which connections are made to at least one chip, the substrate further having embedded between its surfaces elongated stacked capacitive elements (11) composed of a plurality of thin electrically conductive sheets (20) and a plurality of thin layers (14) of dielectric material laminated with each other, respective conductive sheets in the stacks constituting said conductor means, characterized in that adjacent conductive sheets (20) extend in the direction of the opposed surfaces of the substrate at substantially right angles with respect to said opposed surfaces, said sheets having portions (19, 21) at edge surfaces thereof facing outwardly towards said opposed surfaces and reaching said surfaces at different positions with respect to the longitudinal direction of said stacked capacitive elements, said portions thereby being exposed for electrical connection.
Claim 2
Dependent Claim
172 words
Electronic chip carrier (9) including a planar substrate (10) having a first and a second surface opposite to each other and a plurality of electrical conductor means within the substrate to provide electrical interconnection between said opposed surfaces of the substrate (10) from one (6) of which connections are made to at least one chip, the substrate further having embedded between its surfaces elongated stacked capacitive elements (11) composed of a plurality of thin electrically conductive sheets (20) and a plurality of thin layers (14) of dielectric material laminated with each other, respective conductive sheets in the stacks constituting said conductor means, characterized in that adjacent conductive sheets (20) extend in the direction of the opposed surfaces of the substrate at substantially right angles with respect to said opposed surfaces, said sheets having portions (19, 21) at edge surfaces thereof facing outwardly towards said opposed surfaces and reaching said surfaces at different positions with respect to the longitudinal direction of said stacked capacitive elements, said portions thereby being exposed for electrical connection.
Claim 3
Dependent Claim
37 words
Chip carrier according to claim 1, wherein the exposed portions of groups of conductive sheets are interconnected by conductor strips on the substrate which are transverse with respect to the longitudinal direction of said stacked capacitive elements.
Claim 4
Dependent Claim
159 words
Electronic chip carrier including a planar substrate (29, 30, 32, 36) having a first and a second surface opposite to each other and a plurality of electrical conductor means within the substrate to provide electrical interconnection between said opposed surfaces of the substrate (29,30,32,36) from one of which connections are made to at least one chip, the substrate further having embedded between its surfaces elongated stacked capacitive elements composed of a plurality of thin electrically conductive sheets (31,33, 35) and a plurality of thin layers (29, 30, 32, 36) of dielectric material laminated with each other, characterized in that adjacent conductive sheets (31, 33, 35) extend parallel to said opposed surfaces of the substrate, there being elongated electrical conductors (81, 82, 83, 84; Figure 8) extending through the stacked capacitive elements in contact with selected conductive sheets and isolated from others, said elongated electrical conductors providing electrical connection at the opposed surfaces of the substrate at different positions thereof.
Claim 5
Dependent Claim
159 words
Electronic chip carrier including a planar substrate (29, 30, 32, 36) having a first and a second surface opposite to each other and a plurality of electrical conductor means within the substrate to provide electrical interconnection between said opposed surfaces of the substrate (29,30,32,36) from one of which connections are made to at least one chip, the substrate further having embedded between its surfaces elongated stacked capacitive elements composed of a plurality of thin electrically conductive sheets (31,33, 35) and a plurality of thin layers (29, 30, 32, 36) of dielectric material laminated with each other, characterized in that adjacent conductive sheets (31, 33, 35) extend parallel to said opposed surfaces of the substrate, there being elongated electrical conductors (81, 82, 83, 84; Figure 8) extending through the stacked capacitive elements in contact with selected conductive sheets and isolated from others, said elongated electrical conductors providing electrical connection at the opposed surfaces of the substrate at different positions thereof.
References Cited (Backward Citations)
US3663866A
Cited
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