Magnetoelectric transducer and fabrication method therefor

Claim 2

A magnetoelectric transducer comprising: a magnetosensitive thin layer (1); lead connecting electrodes (2) formed on and in part of the magnetosensitive thin layer; an unwindowed film support (3) carrying, on one si thereof, said electrodes and thin layer; leads (4) formed on the film support on the one side thereof; conductive resin (5) applied on the leads, for connecting said leads and said lead connecting electrodes; and sealing mold resin (6) applied on the one side of said film support, for molding said magnetosensitive thin layer, said lead connecting electrodes, portions of said leads, and said conductive resin, said mold resin connecting to said film support.

Claim 3

A magnetoelectric transducer according to Calim 1 wherein said magnetosensitive thin layer comprises an InSb, GaAs, InAs, InAsP or InGaSb thin layer.

Claim 4

A magnetoelectric transducer according to Calim 1 wherein said magnetosensitive thin layer comprises an InSb, GaAs, InAs, InAsP or InGaSb thin layer.

Claim 5

A magnetoelectric transducer according to Claim 1 or 2 wherein said unwindowed film support comprises a polyimide, polyamideimide, polyparabanic acid, triazine film, or epoxy film.

Claim 6

A magnetoelectric transducer according to Claim 1 or 2 wherein said lead is made of copper, silver or tin.

Claim 7

A magnetoelectric transducer according to Claim 1 or 2 wherein said conductive resin comprises an epoxy resin, polyamideimide, or polyimide binder and fine powder of Au, Ag, Cu, Pd or solder dispersed in the binder.

Claim 8

A magnetoelectric transducer according to Claim 1 or 2 wherein said mold resin is made of epoxy resin, silicone resin, polyamideimide or polyimide.

Claim 9

A magnetoelectric transducer according to Claims 1 and 2 wherein said magnetosensitive thin layer is formed on a ferromagnetic support substrate.

Claim 10

A magnetoelectric transducer according to Claims 1 and 2 wherein said magnetosensitive thin layer is formed on a ferrite support substrate, an alumina support substrate, a glass support substrate, a heat resistant resin support substrate or a metal support substrate with insulating surface treatment.

Claim 11

A magnetoelectric transducer according to Claim 8 wherein said thin layer carried on the support substrate is disposed on the one side of said film support with said support substrate interposed between said thin layer and said film support.

Claim 12

A magnetoelectric transducer according to Claim 8 wherein said thin layer carried on the support substrate directly opposes the surface of said film support.

Claim 13

A magnetoelectric transducer according to Claim 9 which further comprises a flux concentrating ferromagnetic material layer disposed on said thin layer.

Claim 14

A magnetoelectric transducer according to Claim 10 which further comprises a flux concentrating ferromagnetic material layer disposed on the other side of said film support to oppose said thin layer.

Claim 15

A resin-mold packaged magnetoelectric transducer comprising: (a) a magnetosensitive thin layer (1); (b) lead connecting electrodes (2) formed on and in part of the magnetosensitive thin layer; (c) leads (4) to be connected to the electrodes for external lead; (d) an unwindowed film support (3) carrying, on one side thereof, said electrodes and thin layer, said leads being integral with the film support and held in a predetermined positional relationship with respect to the film support, one surface of said thin layer being protected by the film support; (e) conductive resin (5) applied on the leads, for connecting said leads and said lead connecting electrodes; and (f) mold resin (6) applied on the one side of said film support, for molding said magnetosensitive thin layer, said lead connecting electrodes, portions of said leads, and said conductive resin, said mold resin connecting to said film support.

Claim 16

A resin-mold packaged magnetoelectric transducer comprising: (a) a magnetosensitive thin layer (1); (b) lead connecting electrodes (2) formed on and in part of the magnetosensitive thin layer; (c) leads (4) to be connected to the electrodes for external lead; (d) an unwindowed film support (3) carrying, on one side thereof, said electrodes and thin layer, said leads being integral with the film support and held in a predetermined positional relationship with respect to the film support, one surface of said thin layer being protected by the film support; (e) conductive resin (5) applied on the leads, for connecting said leads and said lead connecting electrodes; and (f) mold resin (6) applied on the one side of said film support, for molding said magnetosensitive thin layer, said lead connecting electrodes, portions of said leads, and said conductive resin, said mold resin connecting to said film support.

Claim 17

A transducer according to Claim 13 wherein said magnetosensitive thin layer constitutes a pellet which is formed on a ferromagnetic support substrate.

Claim 18

A resin-mold packaged magnetoelectric transducer comprising a magnetosensitive thin layer pellet (1), lead connecting electrodes (2) formed on and in part of the magnetosensitive thin layer, a film support (3) for supporting leads, leads (4) formed on one surface of the film support, means for connecting the leads and said electrodes, and sealing mold resin for molding said thin layer pellet, said lead connecting electrodes, portions of said leads, and said connecting means, said mold resin connecting to said film support, characterized in that said film support comprises an unwindowed film protecting said thin layer pellet, that said leads are formed on the unwindowed film integrally therewith, that said connecting means comprises conductive resin, and that said thin layer pellet, lead connecting electrodes, leads and electrode/lead connecting conductive resin are disposed on one side of said unwindowed film support, and sealed with said mold resin as applied only on the one side of said film support.

Claim 19

A resin-mold packaged magnetoelectric transducer comprising a magnetosensitive thin layer pellet (1), lead connecting electrodes (2) formed on and in part of the magnetosensitive thin layer, a film support (3) for supporting leads, leads (4) formed on one surface of the film support, means for connecting the leads and said electrodes, and sealing mold resin for molding said thin layer pellet, said lead connecting electrodes, portions of said leads, and said connecting means, said mold resin connecting to said film support, characterized in that said film support comprises an unwindowed film protecting said thin layer pellet, that said leads are formed on the unwindowed film integrally therewith, that said connecting means comprises conductive resin, and that said thin layer pellet, lead connecting electrodes, leads and electrode/lead connecting conductive resin are disposed on one side of said unwindowed film support, and sealed with said mold resin as applied only on the one side of said film support.

Claim 22

A fabrication method according to Claim 16 which further comprises applying electrode position indicator marks on said pellet or positioning marks coincident with said pellet on said film support, for positioning said lead connecting electrodes and said leads formed on said unwindowed film support.