Encapsulating housing for hybrid circuit power module

Abstract

Abstract 1. Encapsulation housing for a hybrid power circuit, comprising : - a plane substrate (10), having the function of a housing bottom, and on the upper face of which are fixed the components (15) of the hybrid circuit and are provided the internal connections of the hybrid circuit ; - a cover (11), constituted from an electrically insulating ceramic material, situated above the substrate (10) and fixed on it ; - external connections of the circuit, constituted by pins (12) oriented perpendicular to the substrate (10) and passing through holes (19) formed in the part of the cover (11) parallel to the substrate (10) ; - a dispatcher (14), fixed in thermal coupling under the substrate (10), and ensuring the function of the thermal and mechanical interface with a thermal exchanger, this housing being characterized in that the external connections are constituted by metallic pins of dimensions adapted to support the passage of a current beyond 10 amperes, of which one rectilinear end (12) passes through the cover (11) on which it is welded, and of which the other end (25) is welded on the hybrid circuit.

Inventors

• 👤 Didier Pribat
• 👤 Guy Arnould

Bibliographic Details