EP0034001A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
IC chip mounting assembly and a method of manufacturing such assembly
Assignee: TE Connectivity Corp
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Filing: 1981-01-06
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Granted: —
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Expires: 2001-01-06
Abstract
Abstract An IC chip mounting assembly comprises a lead frame providing a heat sink (3) and leads (4, 5, 6), and a housing (2) moulded on to the lead frame and providing a cavity (7) in which the chip (11) is received, the housing (2) having a wall (9) formed on the heat sink (3) with an aperture (10) in the wall (9) to receive and locate the chip (11). The wall (9) is also formed with a number of solder wells (13) in communication with the aperture (10), which solder wells (13) receive any excess solder (12) when the chip (11) is bonded to the heat sink (3), such bonding being carried out with the use of an induction heating apparatus.
Inventors
- 👤 Joseph Richard Keller
- 👤 Billy Erik Olsson
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 13:16
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/461; H10W70/481; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/075; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
182 words
An IC chip mounting assembly comprising a lead frame providing a heat sink (3) to which the chip (11) is to be bonded by means of solder (12), and a plurality of leads (4, 5, 6) for connection to contact points on the chip (11), and an insulating housing (2) moulded about portions of the heat sink (3) and leads (4, 5, 6) and providing a cavity (7) in which the chip (11) is to be received with a solder blank (12) thereunder for subsequent melting of the solder blank (12) to bond the chip (11) to the heat sink (3), characterised in that the housing (2) has a bottom wall (9) formed on the heat sink (3), the bottom wall (9) having an aperture (10) therein through which the heat sink (3) is exposed to the cavity (7), the aperture (10) being shaped to receive the chip (11) with the solder blank (12) thereunder and position the chip (11) on the heat sink (3), there being a number of solder wells (13) positioned around and in communication with the aperture (10).
Claim 2
Dependent Claim
182 words
An IC chip mounting assembly comprising a lead frame providing a heat sink (3) to which the chip (11) is to be bonded by means of solder (12), and a plurality of leads (4, 5, 6) for connection to contact points on the chip (11), and an insulating housing (2) moulded about portions of the heat sink (3) and leads (4, 5, 6) and providing a cavity (7) in which the chip (11) is to be received with a solder blank (12) thereunder for subsequent melting of the solder blank (12) to bond the chip (11) to the heat sink (3), characterised in that the housing (2) has a bottom wall (9) formed on the heat sink (3), the bottom wall (9) having an aperture (10) therein through which the heat sink (3) is exposed to the cavity (7), the aperture (10) being shaped to receive the chip (11) with the solder blank (12) thereunder and position the chip (11) on the heat sink (3), there being a number of solder wells (13) positioned around and in communication with the aperture (10).
Claim 3
Dependent Claim
39 words
An assembly as claimed in Claim 1, characterised in that the aperture (10) in the bottom wall (9) of the housing (2) is rectangular, there being a solder well (13) in communication with each edge of the aperture (10).
Claim 4
Dependent Claim
55 words
An assembly as claimed in Claim 1 or Claim 2, characterised in that there are three leads (4, 5, 6), one lead (5) being directly connected to the heat sink (3), and the other two leads (4, 6) having portions exposed in recesses (8) in the housing (2) and in communication with the cavity (7).
Claim 5
Dependent Claim
63 words
An assembly as claimed in any preceding claim, characterised by an IC chip (11) received in the aperture (10) in the bottom wall (9) of the housing (2) and secured to the heat sink (3) by solder (12) in the aperture (10) between the chip (11) and the heat sink (3), there also being solder (12) in the solder well or wells (13).
Claim 6
Dependent Claim
41 words
An assembly as claimed in Claim 4 as dependent upon Claim 3, characterised in that contact points on the chip (11) are connected by conductors (14) to the portions of the other two leads (4, 6) exposed in the recesses (8).
Claim 7
Dependent Claim
30 words
An assembly as claimed in Claim 5, characterised in that the cavity (7) is filled with insulating material (15, 16) at least on outer layer (16) of which is solidified.
Claim 8
Dependent Claim
129 words
A method of manufacturing an assembly as claimed in Claim 4, 5 or 6, characterised by the steps of positioning a solder blank (12) and an IC chip (11) in the aperture (10) in the bottom wall (9) of the housing (2) with the solder blank (12) located between the chip (11) and the heat sink (3); urging the chip (11) towards the heat sink (3) with a predetermined force; heating the solder blank (12) thereby to cause the solder blank (12) to melt, the force applied to the chip (11) then causing the solder (12) to assume a predetermined thickness with excess solder (12) flowing into the solder wells (13); and then allowing the solder (12) to set and thus bond the chip (11) to the heat sink.
Claim 9
Dependent Claim
35 words
A method as claimed in Claim 7, characterised in that the solder blank (12) is melted by the use of an induction heating apparatus operative to induce a heating current in the solder blank (12).
References Cited (Backward Citations)
No citation records indexed.
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