EP0032208A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Magnetic bubble domain device package and method of assembly
Assignee: Boeing North American Inc
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Filing: 1980-12-11
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Granted: —
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Expires: 2000-12-11
Abstract
Abstract A magnetic bubble domain device package and method of assembly thereof in which an integral rigid carrier is configured for receiving a magnetic bubble domain device chip and provides a frame for directly winding the drive coils thereon. The carrier also includes predetermined positions for the placement of bias magnets so as to obtain a uniform bias field directed at a predetermined angle with respect to the chip. The rigid carrier is preferably injection molded to provide highly precise dimensions and placement of the various components of the package.
Inventors
- 👤 Fritz Werner Beyerlein
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 14:15
CPC Classifications
G; G11; G11C; G11C19/00; G11C19/02; G11C19/08; G11C19/085
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
58 words
A magnetic bubble domain package comprising: a rigid carrier having a chip-receiving portion designed for receiving a circuit chip; a circuit chip mounted on said chip-receiving portion of said carrier; and a flexible interconnect member having a first conductive layer on a surface thereof disposed in said carrier and making physical and electrical contact with said circuit chip.
Claim 2
Dependent Claim
58 words
A magnetic bubble domain package comprising: a rigid carrier having a chip-receiving portion designed for receiving a circuit chip; a circuit chip mounted on said chip-receiving portion of said carrier; and a flexible interconnect member having a first conductive layer on a surface thereof disposed in said carrier and making physical and electrical contact with said circuit chip.
Claim 3
Dependent Claim
40 words
A magnetic bubble domain package as defined in Claim 1, wherein said rigid carried is an integral unit composed of a synthetic plastic material; and said chip-receiving portion is a substantially rectangular cavity disposed in the center of said carrier.
Claim 4
Dependent Claim
30 words
A magnetic bubble domain package as defined in Claim 2, wherein said cavity includes an aperture extending through said carrier; and said circuit chip is a magnetic bubble domain device.
Claim 5
Dependent Claim
49 words
A magnetic bubble domain package as defined in Claim 1, further comprising means for generating a in-plane magnetic field for said chip comprising coil means mounted on said carrier, including a first and a second coil arranged in orthogonal relationship with respect to one another and surrounding said chip.
Claim 6
Dependent Claim
64 words
A magnetic bubble domain package as defined in Claim 1, wherein said first conductive layer of said flexible interconnect member is partitioned into a discrete number of spaced apart portions; and said spaced apart portions comprises strips extending from said chip to the perimeter of said flexible interconnect member. said strips cantilevering over the edge of said flexible interconnect member at the perimeter thereof.
Claim 7
Dependent Claim
43 words
A magnetic bubble domain package as defined in Claim 5, wherein said flexible interconnect member comprises a sheet having a plurality of apertures in the central portion of said member, said apertures being disposed over corresponding locations of electrical contacts on said chip.
Claim 8
Dependent Claim
40 words
A magnetic bubble domain package as defined in Claim 6, wherein said strips cantilever over the edge of said flexible interconnect member at said apertures; and said strips are bonded at said apertures to respective electrical contacts on said chip.
Claim 9
Dependent Claim
53 words
A magnetic bubble domain package as defined in Claim 5, further comprising a metal lead frame having a plurality of selectively electrical conductors, said lead frame being mounted on said carrier so that respective first ends of said electrical conductors make electrical contact with corresponding ones of said portions of said conductive layer.
Claim 10
Dependent Claim
42 words
A magnetic bubble domain package as defined in Claim 1, wherein said flexible interconnect member has a second conductive layer insulated from said first layer and being electrically grounded; said second layer being configured as a substantially rectangular layer overlying said chip.
Claim 11
Independent Claim
106 words
A method of assembling a magnetic bubble domain package comprising the steps of: placing a magnetic bubble domain chip on a carrier; winding coil means on said carrier so as to surround said magnetic bubble domain chip so as to produce an in-plane rotary magnetic field at the surface of said magnetic bubble domain chip in response to electrical energization thereof; disposing magnetic bias field means on said carrier in spaced relation to said magnetic bubble domain chip so as to produce a uniform magnetic field at a predetermined angle different from a right angle with respect to the surface of said magnetic bubble domain chip.
Claim 12
Independent Claim
106 words
A method of assembling a magnetic bubble domain package comprising the steps of: placing a magnetic bubble domain chip on a carrier; winding coil means on said carrier so as to surround said magnetic bubble domain chip so as to produce an in-plane rotary magnetic field at the surface of said magnetic bubble domain chip in response to electrical energization thereof; disposing magnetic bias field means on said carrier in spaced relation to said magnetic bubble domain chip so as to produce a uniform magnetic field at a predetermined angle different from a right angle with respect to the surface of said magnetic bubble domain chip.
Claim 13
Dependent Claim
122 words
A method as defined in Claim 10, wherein said step of winding coil means comprises winding a first coil of insulated conductive wire about the central portion of said carrier and said magnetic bubble domain chip, and winding a second coil of insulated conductive wire around the central portion of said carrier and said magnetic bubble domain chip in orthogonal relationship with said first coil; and the step of disposing magnetic bias field means on said carrier comprises placing a substantially rectangular body of magnetic material into engagement with portions of said carrier so that said rectangular body is disposed at a predetermined angle with respect to the major surface of the magnetic bubble domain chip, and at a predetermined distance therefrom.
References Cited (Backward Citations)
No citation records indexed.
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