EP0031448A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Thermal conduction module for integrated circuit chips
Assignee: International Business Machines Corp
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Filing: 1980-11-20
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Granted: —
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Expires: 2000-11-20
Abstract
Abstract A thermal conduction module for removing heat from one or more chips (12) located therein consists of a housing (18) made of heat conductive materials forming a cap over the chips. The housing contains one or more openings (22), one opposite each of the chips. More than one heat conductive element (26) is included in each of the openings and are free to move independently lengthwise within the opening. The heat conductive elements are spring loaded (27) so that the end of each element contacts the associated chip. Side springs (29) are located between the sides of adjacent heat conductive elements forcing them mutually away from one another and into contact with the wall of the opening (22).
Inventors
- 👤 Omkarnath Ramnath Gupta
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 08:47
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
171 words
A thermal conduction module for conducting heat from a plurality of integrated circuit chips located therein, the module comprising a substrate (14) on which the chips (12) are mounted, a housing (18) made of heat conductive material sealed to the substrate and forming a cap over the chips, a plurality of elongated openings (22) in the inner surface of the housing each facing a respective chip, the longitudinal axis of each opening being at least approximately perpendicular to the respective chip, a respective heat conductive element (26) disposed in each of the openings and movable longitudinally thereof, and spring means (27) biassing the heat conductive elements into contact with the respective chips, characterised in that each opening (22) contains a plurality of independently movable heat conductive elements (26) each spring biassed into contact with the respective chip (12), and in that further spring means (29) are located between the heat conductive elements in each opening forcing them mutually away from one another and into contact with the wall of the opening.
Claim 2
Dependent Claim
171 words
A thermal conduction module for conducting heat from a plurality of integrated circuit chips located therein, the module comprising a substrate (14) on which the chips (12) are mounted, a housing (18) made of heat conductive material sealed to the substrate and forming a cap over the chips, a plurality of elongated openings (22) in the inner surface of the housing each facing a respective chip, the longitudinal axis of each opening being at least approximately perpendicular to the respective chip, a respective heat conductive element (26) disposed in each of the openings and movable longitudinally thereof, and spring means (27) biassing the heat conductive elements into contact with the respective chips, characterised in that each opening (22) contains a plurality of independently movable heat conductive elements (26) each spring biassed into contact with the respective chip (12), and in that further spring means (29) are located between the heat conductive elements in each opening forcing them mutually away from one another and into contact with the wall of the opening.
Claim 3
Dependent Claim
40 words
A thermal conduction module according to claim 1, wherein the heat conductive elements occupy the major part of the cross-sectional area of the opening and have outer sides which collectively conform to the shape of the wall of the opening.
Claim 4
Dependent Claim
23 words
A thermal conduction module according to claim 2, wherein each opening is cylindrical and the heat conductive elements are segments of a cylinder.
Claim 5
Dependent Claim
38 words
A thermal conduction module according to any preceding claim, wherein the first mentioned spring means comprises individual coil springs each applying an outward force to an associated heat conductive element away from the inner end of the opening.
Claim 6
Dependent Claim
45 words
A thermal conduction module according to any one of claims 1 to 3, wherein the first mentioned spring means is a crown spring having a number of springlets extending therefrom, each springlet being in contact with the inner end of an associated heat conductive element.
Claim 7
Dependent Claim
34 words
A thermal conduction module according to any preceding claim, wherein the further spring means comprises a plurality of bowed pieces of spring material each disposed between a respective adjacent pair of heat conductive elements.
References Cited (Backward Citations)
No citation records indexed.
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