Air-cooled hybrid electronic package

Claim 2

An air-cooled hybrid electronic package including first circuit modules (17) with a first power dissipation, second circuit modules (25) with a second power dissipation, said first power dissipation being greater than said second power dissipation, characterized in that the modules are arranged such that the cooling air first strikes said first modules (17) and, subsequently, said second modules (25).

Claim 3

The electronic package of claim 1, wherein said first modules (17) are, at least partly, enclosed by a chamber (16) into which cooling air is forced, preferably via a first air plenum (18), to provide initial cooling to said first modules (17).

Claim 4

The electronic package of claim 2, wherein said first air plenum (18) is_ located such that, via openings between said chamber (16) and said first plenum (18), said first modules (17) are directly impinged by said air flow.

Claim 5

The electronic package of claim 1, having a second air plenum (23) arranged in the airflow between said first (17) and said second modules (25).

Claim 6

The electronic package of claims 3 and 4, wherein said chamber (16) includes a panel (27) causing the cooling air impinging on said first modules (17) to turn around and flow into said second plenum (23).

Claim 7

The electronic package of claims 3 and 5, wherein said first modules (17) are multi-layer ceramic modules on a circuit board (11), and said second modules (25) are metallized ceramic modules on cards (24) mounted to said circuit board (11).

Claim 8

A hybrid electronic package assembly comprising a plurality of first circuit modules (17) mounted on a planar printed circuit board (11), a plurality of printed circuit cards (24) arranged vertically on opposite sides of said first circuit modules (17) and having a plurality of second circuit modules (25) mounted thereon, characterized by a chamber (16) housing said first modules (17), a top air plenum (18) located over said chamber (16) and having bottom openings (19) located directly over each of said first circuit modules (17), means (22) for supplying a flow of air into said top plenum (18), said air flowing through said openings (19) and impinging against the top of each of said first modules (17), and a back air plenum (23) connected to the back of said chamber (16) for directing the air flow out of said chamber (16) through said back plenum (23), and across said circuit cards (24) and said second circuit modules (25).

Claim 9

A hybrid electronic package assembly comprising a plurality of first circuit modules (17) mounted on a planar printed circuit board (11), a plurality of printed circuit cards (24) arranged vertically on opposite sides of said first circuit modules (17) and having a plurality of second circuit modules (25) mounted thereon, characterized by a chamber (16) housing said first modules (17), a top air plenum (18) located over said chamber (16) and having bottom openings (19) located directly over each of said first circuit modules (17), means (22) for supplying a flow of air into said top plenum (18), said air flowing through said openings (19) and impinging against the top of each of said first modules (17), and a back air plenum (23) connected to the back of said chamber (16) for directing the air flow out of said chamber (16) through said back plenum (23), and across said circuit cards (24) and said second circuit modules (25).

Claim 10

The hybrid electronic package assembly of .claim 7, wherein said first circuit modules (17) are multi-layer ceramic modules and said second circuit modules (25) are metallized ceramic modules.