EP0015004A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Dry-developing photosensitive dry film resist, a solder mask made thereof, and process for using the dry film resist
Assignee: EIDP Inc
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Filing: 1980-02-22
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Granted: —
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Expires: 2000-02-22
Abstract
Abstract A dry-developing dry film resist is provided comprising a Photopolymerizable layer preferably sandwiched between a support sheet and a cover sheet, the layer comprising polymerizable monomer in excess of the absorptive capacity of the layer, photopolymerization initiator, and binder component of a plurality of polymers, at least one of these polymers being incompatible so as to be present as a dispersion in the layer to reduce the cohesive strength of the layer. The layer is developed by peeling away the support sheet, the unexposed area of the layer adheringto the support sheet and the exposed area adhering to the substrate to which it was laminated to form a resist image against such treatments as etching, plating and soldering, especially to make a printed circuit.
Inventors
- 👤 Abraham Bernard Cohen
- 👤 Joseph Edmund Gervay
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 18:31
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/34; H; H05; H05K; H05K3/00; H05K3/0073; H05K3/0079
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
223 words
Dry-aeveioping ary rilm resist for developing an image on a surface by removal of unexposed area from exposed area of said resist without the use of solvent comprising a flexible support sheet and a photopolymerizable layer having a greater adhesion to said support sheet than to said surface, but upon exposure to actinic radiation, having a greater adhesion to said surface than to said support sheet, said layer comprising a plurality of polymeric binders, at least one of said binders being incompatible so as to be present as a dispersion in said layer to provide an appreciable reduction in the cohesive strength of said layer as compared to when said incompatible binder is not present in said layer, free-radical polymerizable monomer, and photopolymerization initiator for initiating the polymerization of said monomer upon exposure of said layer to actinic radiation, said monomer being present in an amount in excess of the absorptive capacity of said layer, said layer being dry developed by lamination to said surface, imagewise exposure of said layer to actinic radiation to cause the exposed area of said layer to achieve said greater adhesion to said surface, and peeling away said support sheet, the reduced cohesive strength of said layer enabling the unexposed area of said layer to break free from said exposed area and be removed therefrom by said peeling.
Claim 2
Dependent Claim
223 words
Dry-aeveioping ary rilm resist for developing an image on a surface by removal of unexposed area from exposed area of said resist without the use of solvent comprising a flexible support sheet and a photopolymerizable layer having a greater adhesion to said support sheet than to said surface, but upon exposure to actinic radiation, having a greater adhesion to said surface than to said support sheet, said layer comprising a plurality of polymeric binders, at least one of said binders being incompatible so as to be present as a dispersion in said layer to provide an appreciable reduction in the cohesive strength of said layer as compared to when said incompatible binder is not present in said layer, free-radical polymerizable monomer, and photopolymerization initiator for initiating the polymerization of said monomer upon exposure of said layer to actinic radiation, said monomer being present in an amount in excess of the absorptive capacity of said layer, said layer being dry developed by lamination to said surface, imagewise exposure of said layer to actinic radiation to cause the exposed area of said layer to achieve said greater adhesion to said surface, and peeling away said support sheet, the reduced cohesive strength of said layer enabling the unexposed area of said layer to break free from said exposed area and be removed therefrom by said peeling.
Claim 3
Dependent Claim
25 words
The dry film resist of claim 1 having sufficient viscosity to be wound up into a tight roll without loss of thickness of said layer.
Claim 4
Dependent Claim
50 words
The dry film resist of claims 1 or 2 and additionally a coversheet adhered to the surface of said layer opposite the surface to which said support sheet is adhered, the adhesion of said coversheet to said layer being less than the adhesion of said support sheet to said layer.
Claim 5
Dependent Claim
16 words
A tight roll of at least 50 layers of the dry film resist of claim 3.
Claim 6
Dependent Claim
14 words
The dry film resist of claim 1 having a thickness up to 0.005 cm.
Claim 7
Dependent Claim
203 words
A solder mask for dry development of a polymerized image on selected areas of a surface, especially a printed circuit board, to protect said selected areas from molten solder and being capable of also acting as a permanent dielectric coating for said selected areas, comprising a flexible support sheet and a photopolymerizable layer having a greater adhesion to said support sheet than to said surface, but upon exposure to actinic radiation, having a greater adhesion to said surface than to said support sheet, said layer comprising a plurality of polymeric binders at least one of said binders being incompatible so as to be present as a dispersion in said layer to provide an appreciable reduction in the cohesive strength of said layer as compared to when said incompatible binder is not present in said layer, free-radical polymerizable monomer, and photopolymerization initiator for initiating the polymerization of said monomer, said monomer being present in an amount in excess of the absorptive capacity of said layer, the polymerized image on said surface, formed by laminating said layer to said surface, imagewise exposing said layer to actinic radiation and peeling away said support sheet to develop said image being resistant to molten solder and a dielectric.
Claim 8
Dependent Claim
203 words
A solder mask for dry development of a polymerized image on selected areas of a surface, especially a printed circuit board, to protect said selected areas from molten solder and being capable of also acting as a permanent dielectric coating for said selected areas, comprising a flexible support sheet and a photopolymerizable layer having a greater adhesion to said support sheet than to said surface, but upon exposure to actinic radiation, having a greater adhesion to said surface than to said support sheet, said layer comprising a plurality of polymeric binders at least one of said binders being incompatible so as to be present as a dispersion in said layer to provide an appreciable reduction in the cohesive strength of said layer as compared to when said incompatible binder is not present in said layer, free-radical polymerizable monomer, and photopolymerization initiator for initiating the polymerization of said monomer, said monomer being present in an amount in excess of the absorptive capacity of said layer, the polymerized image on said surface, formed by laminating said layer to said surface, imagewise exposing said layer to actinic radiation and peeling away said support sheet to develop said image being resistant to molten solder and a dielectric.
Claim 9
Dependent Claim
24 words
The solder mask of claim 6 wherein said incompatible binder is poly(alkyl acrylate) wherein the alkyl group contains from 2 to 8 carbon atoms.
Claim 10
Dependent Claim
13 words
The solder mask of claim 6 wherein said monomer is an acrylate monomer.
Claim 11
Dependent Claim
22 words
The solder mask of claims.6 and 7 wherein at least one of the other of said polymer binders is a chlorine-containing polymer.
Claim 12
Dependent Claim
18 words
The dry film resist of claim 1 wherein said layer is laminated to said surface which includes copper.
Claim 13
Dependent Claim
86 words
A process for selectively modifying a surface, comprising laminating the dry film resist of claim 1 to said surface, imagewise exposing said layer to actinic radiation, removing said support sheet from said surface, whereby the exposed area of said layer remains on said surface and the unexposed area of said layer remains on said support sheet to be removed therewith, treating the resultant exposed area of said surface to modify it, the exposed area of said layer protecting the remainder of said surface from said treating.
Claim 14
Dependent Claim
31 words
The process of claim 10 wherein said exposed area of said layer is resistant to molten solder and said treating involves contacting said exposed area of said surface with molten solder.
Claim 15
Dependent Claim
16 words
The process of claim 10 wherein said treating involves plating said exposed area of said surface.
Claim 16
Dependent Claim
17 words
- The process of claim 10 wherein said treating involves etching said exposed area of said surface.
Claim 17
Dependent Claim
22 words
The process of claims 12 or 13 and additionally, removing said exposed area of said layer from said surface after said treating.
References Cited (Backward Citations)
No citation records indexed.
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