EP0010352A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Opto-electrical semiconductor device
Assignee: Motorola Solutions Inc
•
Filing: 1979-09-12
•
Granted: —
•
Expires: 1999-09-12
Abstract
Abstract A package for semiconductor devices (8) includes a segment (38) of optical fiber within a ferrule (30) for direct attachment of the package to a fiber optic connector.
Inventors
- 👤 Albert B. Cutler Iii
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 07:12
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4204; G02B6/421
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
82 words
In a packaging system for providing a compatible interface between an active semiconductor optical element and a connector for an optical fiber transmission line, the improvement comprising: a segment of optical fiber having two ends; transparent plastic bonding material disposed around said optical fiber segment and on the active semiconductor element; and package means enclosing said optical fiber segment and said active semiconductor element for maintaining one of said ends of said optical fiber segmert in close proximity to said active element.
Claim 2
Dependent Claim
82 words
In a packaging system for providing a compatible interface between an active semiconductor optical element and a connector for an optical fiber transmission line, the improvement comprising: a segment of optical fiber having two ends; transparent plastic bonding material disposed around said optical fiber segment and on the active semiconductor element; and package means enclosing said optical fiber segment and said active semiconductor element for maintaining one of said ends of said optical fiber segmert in close proximity to said active element.
Claim 3
Dependent Claim
118 words
A packaging system for an active semiconductor optical element and an optical fiber segment wherein an active surface of the semiconductor is positioned perpendicular to an axis of the packaging system and electrical connections for the semiconductor protrude from the system in a first direction parallel to the axis; the system further comprising: a ferrule member; and a fiber optical segment having first and second ends, said first end being adhered to said active semiconductor element with a transparent bonding agent for providing a low loss light transfer between the active semiconductor element and said optical fiber segment, said ferrule member surrounding and supporting said optical fiber segment and the active semiconductor element in a predetermined spatial relationship.
Claim 4
Dependent Claim
118 words
A packaging system for an active semiconductor optical element and an optical fiber segment wherein an active surface of the semiconductor is positioned perpendicular to an axis of the packaging system and electrical connections for the semiconductor protrude from the system in a first direction parallel to the axis; the system further comprising: a ferrule member; and a fiber optical segment having first and second ends, said first end being adhered to said active semiconductor element with a transparent bonding agent for providing a low loss light transfer between the active semiconductor element and said optical fiber segment, said ferrule member surrounding and supporting said optical fiber segment and the active semiconductor element in a predetermined spatial relationship.
Claim 5
Dependent Claim
97 words
A packaging system for an active semiconductcr optical element having an optical interface and an electrical interface, said packaging system comprising: at least one enclosure; an active semiconductor alement; an optical fiber segment having two erds, one of said ends of said optical fiber being in close proximity to said active semiconductor element, the second of said ends being flush with a face of said at least one enclosure for interfacing with a optical fiber transmission line; and connection means for providing an electrical interface to the active semiconductor element, said connection means protruding from said enclosure.
Claim 6
Dependent Claim
97 words
A packaging system for an active semiconductcr optical element having an optical interface and an electrical interface, said packaging system comprising: at least one enclosure; an active semiconductor alement; an optical fiber segment having two erds, one of said ends of said optical fiber being in close proximity to said active semiconductor element, the second of said ends being flush with a face of said at least one enclosure for interfacing with a optical fiber transmission line; and connection means for providing an electrical interface to the active semiconductor element, said connection means protruding from said enclosure.
Claim 7
Dependent Claim
27 words
The packaging system according to claim 3 further comprising transparent bonding means for adhering said one end of the optical fiber segment to said active semiconductor element.
Claim 8
Dependent Claim
25 words
The packaging system according to claim 3 wherein said enclosure is symmetrical about an axis thereof and said segment is approximately parallel to said axis.
Claim 9
Dependent Claim
22 words
The packaging system according to claim 5 further comprising transparent bonding means for adhering said optical fiber to said active semiconductor element.
Claim 10
Dependent Claim
62 words
The system according to claim 3 wherein said enclosure is a molded plastic having a relatively small diameter at said flush end and having a relatively large diameter at said close proximity end, said larger diameter end being molded to contact and adhere to said active semiconductor element, said at least one enclosure being of molded material and enclosing said fiber segment.
Claim 11
Dependent Claim
12 words
The packaging system according to claim 7 wherein said enclosure is opaque.
Claim 12
Independent Claim
112 words
A method for making an optical-electrical element comprising the steps of: molding a transparent plastic element having a larger end and a smaller end, said larger end being in intimate contact with an active semiconductor element having electrical connections thereto, said smaller end being of predetermined dimension, said transparent plastic element being adaptable to a fiber optic transmission line; molding a plastic enclosure about said transparent plastic element for protecting said transparent plastic element and said electrical connections, said electrical connections protruding from said larger end; and polishing said smaller end of said transparent plastic element and said plastic enclosure to form a flush composite surface for mating another transparent element thereto.
Claim 13
Independent Claim
112 words
A method for making an optical-electrical element comprising the steps of: molding a transparent plastic element having a larger end and a smaller end, said larger end being in intimate contact with an active semiconductor element having electrical connections thereto, said smaller end being of predetermined dimension, said transparent plastic element being adaptable to a fiber optic transmission line; molding a plastic enclosure about said transparent plastic element for protecting said transparent plastic element and said electrical connections, said electrical connections protruding from said larger end; and polishing said smaller end of said transparent plastic element and said plastic enclosure to form a flush composite surface for mating another transparent element thereto.
Claim 14
Dependent Claim
12 words
The method according to claim 9 wherein said plastic enclosure is opaque.
References Cited (Backward Citations)
US3948582A
Cited
US3932761A
Cited
US4045120A
Cited
US3999837A
Cited
DE2613069A1
Cited
US4065203A
Cited
US4118100A
Cited
DE2755372A1
Cited
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.