DATA CARRIER WITH INTEGRATED CIRCUIT

Abstract

Abstract The invention relates to a data carrier (1) with integrated circuit (5) and describes a method for producing data carriers. The data carrier (1) has the form of a card in which an appropriately shaped two-step recess (3) is provided for installing the carrier element (11). The carrier element (11) consists of a substrate (8) on which the integrated circuit is arranged. As protection against mechanical loading, at least the integrated circuit (5) is surrounded by a casting compound (10), for example a casting resin. The carrier element (11) is bonded to the card body by means of a thermally activatable adhesive layer (7) under the action of heat and pressure. The adhesive layer (7) is provided with an opening (19) which is dimensioned in such a manner that when the carrier element (11) is bonded to the card body (1), the casting compound (10) is at least partially covered by the adhesive layer in its edge region. <IMAGE>

Inventors

• 👤 Yahya Haghiri
• 👤 Renee-Lucia Barak

Bibliographic Details