DE2902002A1
Expired / Lapsed
DE
⏱️ 0.0 years remaining
Three=dimensional integrated circuits - mfd. by joining wafer stack with contacts through conductive adhesive
Assignee: Individual
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Filing: 1979-01-19
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Granted: —
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Expires: 1999-01-19
Abstract
Abstract Three-dimensional integrated circuit is produced by stacking several plates with integrated circuits at right angles to the large plate surface, at a distance between the plates which is much smaller than the plate dia. Power or signal transmission links join the plates to each other. Pref. the thickness of the plates is under 50 microns (2 microns) and their spacing is less than 30 microns (3 microns). This produces monolithic integrated modules with a very high spatial density of active or storing elements without using other than conventional technologies.
Inventors
- 👤 Gerhard Krause
Bibliographic Details
Application Number
—
Jurisdiction
DE
Data Source
google_patents
Last Synchronized
2026-11-03 10:59
CPC Classifications
H; H10; H10W; H10W90/00; H10P; H10P50/00; H10P50/20; H10P50/26; H10P50/262; H10P95/00; H10W20/00; H10W20/40; H10W70/00; H10W70/60; H10W70/611; H10W90/20; H10W90/293; H10W90/401; H10W72/00; H10W72/01; H10W72/012; H10W72/01261; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07339; H10W72/074; H10W72/20; H10W72/231; H10W72/234; H10W72/261; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/731; H10W90/732
Claims Analysis
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