DE2447653A1
Expired / Lapsed
DE
⏱️ 0.0 years remaining
Printed circuit boards permitting mechanical forming after plating - have fold lines defined by accurate removal of insulating base material
Assignee: Hans Kolbe and Co
•
Filing: 1974-10-05
•
Granted: —
•
Expires: 1994-10-05
Abstract
Abstract The application is to printed circuit boards, typically with conductor patterns on each side, which have to be mechanically shaped around corners. At the point where the board has to be formed the insulation base (12) is slit (32) and the outer edges of the base chamfered (34, 35) so that when the bending is carried out the chamfered faces come together to define the angle. The faces may be treated with adhesive to make a permanent joint. Typically the developed width of the slit in the insulation is equal to the board thickness, and the depth approximately half the board thickness.
Inventors
- 👤 Konrad Herndl
- 👤 Guenter Nitsche
- 👤 Theodor Passlick
Bibliographic Details
Application Number
—
Jurisdiction
DE
Data Source
google_patents
Last Synchronized
2026-11-05 02:36
CPC Classifications
H; H02; H02G; H02G5/00; H02G5/02; H05; H05K; H05K3/00; H05K3/0011; H05K3/0014; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/05; H05K2201/057; H05K2203/00; H05K2203/02; H05K2203/0228; H05K2203/30; H05K2203/302; H05K3/0044
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.