CA1151789A
Expired / Lapsed
CA
⏱️ 0.0 years remaining
Photopolymerization type resin composition and solder resist containing the same
Assignee: Panasonic Holdings Corp
•
Filing: 1980-03-19
•
Granted: 1983-08-09
•
Expires: 2000-03-19
Abstract
Abstract ABSTRACT OF THE DISCLOSURE: A photopolymerization type resin composition consisting of one or more resins selected from a group consisting of resol type epoxy-acrylates, novolak type epoxy-acrylates, resol type epoxy-methacrylates and novolak type epoxy-meth-acrylates; an unsaturated compound whose end groups of ethylene are less than those of said one or more resins; and a photo-sensitizer. The resin composition is useful for the solder-resist applied to a flexible base plates of printed circuit boards.
Inventors
- 👤 Junji Ikeda
- 👤 Keiji Saeki
- 👤 Tamotsu Wakahata
Bibliographic Details
Application Number
—
Jurisdiction
CA
Data Source
google_patents
Last Synchronized
2026-10-31 13:17
CPC Classifications
—
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
51 words
A photopolymerization type resin composition consisting of one or more resins selected from a group consisting of resol type epoxy-acrylates, novolak type epoxy-acrylates, resol type epoxy-methacrylates and novolak type epoxy-methacrylates; an unsaturated compound whose end groups of ethylene are less than those of said one or more resins; and a photosensitizer.
Claim 2
Dependent Claim
51 words
A photopolymerization type resin composition consisting of one or more resins selected from a group consisting of resol type epoxy-acrylates, novolak type epoxy-acrylates, resol type epoxy-methacrylates and novolak type epoxy-methacrylates; an unsaturated compound whose end groups of ethylene are less than those of said one or more resins; and a photosensitizer.
Claim 3
Dependent Claim
25 words
A photopolymerization type resin composition as set forth in Claim 1 wherein said unsaturated compound is a low-molecular polyester resin having acryloyl or methacryloyl groups.
Claim 4
Dependent Claim
44 words
A photopolymerization type resin composition as set forth in Claim 1 wherein said unsaturated compound is a low molecular polyester resin having methacryloyl groups and the end groups of ethylene which are less than those of a low molecular polyester resin having acryloyl groups.
Claim 5
Dependent Claim
52 words
A solder-resist-ink comprising of one or more resins selected from a group consisting of resol type epoxy-acrylates, novolak type epoxy-acrylates, resol type epoxy-methacrylates and novolak type epoxy-methacrylates; an unsaturated compound whose end groups of ethylene are less than those of said one or more resisns; a photosensitizer; and body and coloring pigments.
Claim 6
Dependent Claim
52 words
A solder-resist-ink comprising of one or more resins selected from a group consisting of resol type epoxy-acrylates, novolak type epoxy-acrylates, resol type epoxy-methacrylates and novolak type epoxy-methacrylates; an unsaturated compound whose end groups of ethylene are less than those of said one or more resisns; a photosensitizer; and body and coloring pigments.
Claim 7
Dependent Claim
23 words
A solder-resist-ink as set forth in Claim 4 wherein said unsaturated compound is a low molecular polyester resin having acryloyl and/or methacryloyl groups.
Claim 8
Dependent Claim
44 words
A solder-resist-ink as set forth in Claim 4 wherein said unsaturated compound consists of a low molecular polyester resin having acryloyl groups and a low molecular polyester resin having methacryloyl groups and end groups of ethylene which are less than those of said resins.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.