DEVICE FOR SETTING DISC-SHAPED OBJECTS, ESPECIALLY SILICONE DISC

Abstract

Abstract A device for etching silicon wafers has a holder (1) for the silicon wafers. Provided in the surface (9, 10) of this holder which faces the silicon wafer (11) is an annular nozzle (8) which can be fed with compressed gas to form a gas cushion between the holder (1) and the silicon wafer (11). The gas emerging between the wafer (11) and the holder (1) prevents treatment liquid from reaching the underside of the wafer (11). The holder (1) is mounted in the interior (21) of a ring-shaped pot (20) having at least two annular channels (25, 26, 27) which are open in the direction of its interior (21). Devices are also provided for raising and lowering the holder (1) with respect to the pot (20) and for causing the holder, to rotate about its axis (14), which coincides with the central axis of the pot (20). <IMAGE>

Inventors

• 👤 Franz Sumnitsch

Bibliographic Details